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Xpert3 kit works with the SuperM.O.L.E. Gold thermal profiler to automate convection reflow oven process development. Distills recipe development into three steps: Create Signature; Plan Target; and Set & Verify.

Signature Wizard helps create an oven signature file for your reflow oven at a given convection rate. With that oven selection in place you plan robust target profiles, choosing from the 400 solder paste formulations in the database. Entering Assembly Properties information completes the planning stage and Set & Verify delivers the oven recipe.

A solder paste specification may be set to your choice of Ramp-Soak-Spike or a Ramp-to-Spike profile. Converting an existing process to a Pb-free paste is quick and easy. Qualify your oven's Pb-free capability by observing if the required zone setpoints per conveyor speed exceed the oven's maximum capability. The Transpose command immediately converts a profile to your new oven, and the system works with any reflow oven.

ECD, www.ecd.com

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