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Carlsbad, CA — Machine Vision Products (MVP) will highlight the Supra M AOI system in booth 8650 at Semicon West this week in San Francisco, CA.

Modeled after the AutoInspector 1820 series, allowing advanced capabilities in a smaller footprint. With full solder joint inspection and measurement capabilities, comes standard with one large-format digital camera and a high-precision linear x/y stage. The one-camera system allows for a configurable field of view depending on the application. Standard pixel resolution is adjustable from 15 to 22 mm/pixel. Has CAD-driven, library-based programming for precise measurement of component placement and solder joint analysis.

In a 960 x 965 mm footprint, provides an acquisition speed of 20 1.4 images/sec. Can achieve up to 45 sq. cm./sec., depending on board layout and density.

Offers an inspection envelope of 16 x 18", a height of 2,083 mm and adjustable conveyor height from 735 to 965 mm. Includes on-the-fly single camera acquisition, improved optics and lighting, 0201 capability and adaptable algorithms with high detectability and low PPM false accept and false reject rates.

Machine Vision Products Inc., sales@machinevisionproducts.com

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