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Speedline Technologies has released Benchmark 5.0 software for its Camalot XyflexPro liquid dispensing system for surface mount electronics and chip packaging applications.
 
The new release reportedly offers increased throughput of up to 15%, improved process control and enhanced program functionality.
 
New features include a Flip Chip Calculator, used to determine underfill weight and volume for both die within a cavity and standard assembly methods. TurnBack allows any of the dispense units or pumps to be reversed. This gives precise control of material on the needle tip and can eliminate material balling or dripping due to backpressure.
 
Also features Die Edge Detection, a one-snap process that simultaneously finds all four edges of a flip chip for pinpoint positioning. The vision algorithms have been further developed for edge find of any rotated die, CSP/BGAs and other molded packages.
 
Line Sequence command for faster, smoother  travel around corners when dispensing underfill; encapsulation and micro display applications; needle cleaning during product transfer; faster vision processing; and a pipeline conveyor mode that allows parallel product transfer between conveyor zones help to reduce transfer time by up to 40%.
 
Easily upgradeable, available as an option for all existing XyflexPro users and shipped standard on new systems.
 
Speedline Technologies, speedlinetech.com

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