Kester will showcase EnviroMark 907 (EM907), a no-clean, lead-free solder paste, in booth 5636 at AT Expo next week. Designed for high-yield, lead-free manufacturing, was engineered specifically for the higher thermal demands and higher melting temperature lead-free alloys, such as the SnAgCu (SAC) alloys.
 
Features a long stencil life, offers lead-free joints that closely resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains excellent print quality at print speeds up to 6 in/sec. (150 mm/sec). Has excellent cold and hot slump behavior, preventing bridges and solder ball formation.
 
Said to have excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features solderability to an array of component metallizations, including Pd/Ag and Alloy 42.
 
Flux chemistry offers bright solder joints, even in air reflow. This cosmetic feature is an added benefit during inspection. The paste leaves only a light-colored residue and provides a stable tack life.
 
Reflowable in air or nitrogen, prints down to 0201 pad sites, has superior printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
 
Kester, kester.comhttp://www.kester.com

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