News
News
Rohm & Hass Exhibits Electronic Materials at Productronica
Published: 19 September 2005
by Staff
The company will present new processes for both the printed circuit, packaging and finishing markets.
Circuposit C3 Ultra is the latest self-accelerating electroless copper process and is complemented by two additions to the electroplating portfolio with Copper Gleam Microfill copper via-filling process and Copper Gleam CuPulse pulse plating acid copper process.
The final finish product line is enhanced with Duraposit SMT 88 electroless nickel for ENIG applications, and Pallamerse SMT 2000 electroless palladium.
In the imaging sector, R&H will show the Lithojet UV Mask, for inkjet able phototool, and its halogen-free soldermask product, Durashield 5900HF.
The company has created planarisation package for thick copper circuitry with Filler Coater DF 1122 and Durashield V42 Filler and Mask.
The Packaging and Finishing markets see a new pure tin, Solderon ST-380, and high speed bright tin, Solderon BT-280, designed for the lead-free electrical connector applications.
Rohm and Haas, rohmhaas.com
Press Releases
- KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Chihuahua Expo & Tech Forum
- Nordson Electronics Solutions Completes its Europe Location Move to a New, State-of-the-Art Facility
- Ascentron Upgrades Entire Hand Soldering Line to Ersa i-CON 1 MK2
- High-Speed Line Inspection at the SMTA Guadalajara 2024