Feinfocus and Xradia announce a new  3-D x-ray inspection technology for the semiconductor packaging and medical device industries.
 
The microXCT defect detection system uses non-destructive 3-D tomography to view the complete structure of advanced packages. Unlike conventional x-ray imaging systems that lose resolution during tomography, this system scans packages in 3-D at full resolution. Multiple resolution modes allow users to switch from navigation at 30µm to high-resolution defect localization and characterization at 1 µm. Automated 3-D tomography features virtual cross-section capability, eliminating the need for sample preparation. Can image and construct a high-resolution 3-D Volumetric dataset with up to 1000 cross-sectional slices in 15min. Has a compact design.
 
FEINFOCUS, .ch

• Prev
• Next