Circuits Assembly Online Magazine - TYCO Backplane Connector Goes Beyond 10 Gigs

News

Building on its portfolio of high-speed backplane connectors, Tyco has introduced the Z-PACK MAX connector as a cost-effective interconnect for backplane applications where high speed, high density and high performance are needed.

“In listening to our customers we heard the need for a cost effective high-speed product and quickly focused significant resources in responding to that need. The result of that effort is the Z-PACK MAX product line,” said Bob Hnatuck, high-speed backplane connector product manager. “One of our goals is to offer a portfolio of products which provides our customers with options and gives them the flexibility to meet their requirements. The Z-PACK MAX backplane connector system performs at speeds up to 10 Gbps and beyond for applications including servers, storage devices, switches, routers and similar high-speed signal applications.”

To achieve the 10+ Gbps speed, ground contacts are positioned within each connector column and are combined with lead frame arrangements within the connector to achieve low crosstalk and high throughput. Employs a shield-less design. Dual point contact mating and compliant pin board mounting help ensure reliability. Meet Telcordia requirements and are RoHS compliant.

Available in a five-pair version (with 26 pairs per 10 mm, or 66 differential pairs per in.), or a four-pair version (with 21 pairs per 10 mm, or 53 differential pairs per in.). Accommodate 25.40 mm (five pair) and 20.32mm (four pair) card slot spacing. Planned product extensions include a three-pair version for narrow card pitch applications, right angle pin headers for coplanar applications, vertical receptacles for mezzanine applications and high-speed cable assemblies.

Tyco Electronics, www.tycoelectronics.com