Macromelt low-pressure molding is a fast, flexible, low-pressure alternative to conventional injection molding and potting techniques. It can encapsulate diverse components with highly miniaturized features. The polyamide hotmelt material allows encapsulation of the circuitry and the formation of the outer shell of the component in one step. The process only requires a melt unit, low pressure dispensing system and a mold.
 
Henkel, electronics.henkel.com  
Apex booth 1321

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