EnviroMark 907 (EM907)  is a no-clean, lead-free solder paste designed for high-yield lead-free manufacturing. Said to offer a long stencil life and Pb-free joints that resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains print quality at high print speeds — up to 6 in/sec. (150 mm/sec.). Said to have excellent cold and hot slump behavior to prevent bridges and solder ball formation.
 
Reportedly has excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features high levels of solderability to a wide array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, comparable to 63/37, even in air reflow. The paste leaves only a light-colored residue and provides a stable tack life. Reflowable in air or nitrogen, prints down to 0201 pad sites, has printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
 
Kester, kester.com
Booth 1085

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