FINETECH will highlight the compact rework system Fineplacer CRS10 at Nepcon South China on Aug. 29 to Sept. 1.
 
The rework station handles the complete rework process and supports automated component placement and lift-off. Has user-friendly Chinese software. Better than 10 µm placement accuracy allows for rework of high density packaged boards. Large field of view accommodates large component alignment (e.g., super BGAs with side lengths of up to 45 mm), without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". Typical applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components such as 0201, 0402, 0603 and connectors, RF-shields, shielding frames, flip chip rework and customized applications.
 
FINETECH, www.finetech.de
Nepcon Shenzhen booth 2G71

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