Practical Components, the supplier of dummy components, has added Amkor Technology's PoP (PSvfBGA), a stackable very thin fine-pitch BGA package. 

Also new is Amkor's tsMLF (Thin Substrate Micro LeadFrame-TAPP), a sub-100 micron flip chip test die, and the redesigned Cookson, Indium and AIM print test boards and kits.

Also new is Amkor's CVBGA very thin ChipArray BGA.

practicalcomponents.com

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