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µm (paste height, area and volume measurements with Gage R&R <10%). Said to offer higher magnification of small solder paste pads. Reportedly ideal for batch inspection of system-on-chip, flip-chip and as NPI process qualification. Can be interchanged with a standard sensor to operate in both modes with a single machine. SE 300 Ultra platform now offers the capability to read 1- and 2-D topside barcodes using the sensor head.
 
CyberOptics Corporation, www.cyberoptics.com