The SVS Ascent platform is for in-line, 3-D SMT inspection of solder paste depositions and component placement process control. Handles boards up to 20 x 24". Features an all-solid-state laser scanning platform with a reported 8 MHz data acquisition rate, all digital processing, and 8X oversampling. Analyzes data pixel by pixel, without merging or blending areas of acquired data. Said to permit panel setup from CAD data within 10 minutes and to detect flaws in volume, area, height, x/y position, coplanarity and bridging.
 
GSI Group, www.gsig.com

 

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