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Laser cutting system is for SMT solder paste stencils and other thin metal components and parts. Said to cut standard SMT stencils at 13,000-18,000 apertures per hr. (an increase of 30-50%). Features include LongLife laser source, which consists of a high-power fiber laser; reportedly operates at reduced power requirements. FastCut beam delivery system enables MultiCut to cut small apertures of any shape without any table motion. Said to boost production throughput, especially when cutting BGA and µBGA stencils.

LPKF Laser & Electronics, www.lpkfusa.com