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The 300 and 400 series meet the range of needs for selective soldering of components following reflow.

Equipment Advances
Juki 300 is a complete, economical solution for selective soldering of conventional components. It is compatible with lead and Pb-free alloys, and is highly reliable. The system has a drop jet fluxer for smaller soldering areas, a spray fluxer for larger areas and a pressurized tank that supplies flux consistently to the spray heads. Juki 300 provides a convection preheater for flux activation. Up to three different quickchange nozzles, ranging from 4 to 30 mm in diameter, are available. Special nozzles can be designed for custom applications. An N2 management system is used to reduce consumption. The inert environment also limits dross buildup, widening the process window and reducing maintenance.

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The Juki 400 has a three-stage batch or inline system for high-speed, automated selective soldering.

The system comes equipped ready to begin production. In addition to a soldering unit with nitrogen inertion at the mini-wave, it includes: exchangeable mini-wave nozzle (one 6 mm nozzle included), autofeeder solder roll device, machine and offline programming software, float sensor for maintaining constant levels of solder in the pot and a Pb-free exchangeable solder pot with 25 kg capacity.

Juki 400 is a low- to mid-cost flexible machine for either batch or inline capabilities. The system offers the functionality and features of the 300, plus a three-stage inline system for a high-speed, automated soldering process. It can be customized to meet specific requirements.

Juki 400 is Pb-free ready; it has multiple solder pots, permitting the use of leaded and Pb-free solder without hardware changes. This advancement provides significant savings. The system has multiple mini-wave nozzles, for flexibility. Up to four are available; however, it can be configured with three mini-waves in a panel, two mini-waves in a panel with different nozzles, with one mini-wave plus one full wave system or as a dip-soldering module. In addition to the mini-wave, a traditional full wave up to 400 mm can be installed and run during the same process. A key advantage of the full wave on the selective soldering machine is that users can use the same parameters to control the full wave as the mini-wave; e.g., multiple speeds, dwell, etc. This feature results in improved speed and throughput rates. Additional speed/throughput improvements can be achieved through an XY Fluxer option, which changes the 400 from a single-action system into a multiple-action system. The triple cycle permits the system to flux, preheat and solder simultaneously.

The system uses a patented Tenifer nitrate process to protect from de-alloying caused by aggressive alloys. This is an actual process - not a coating that is embedded into the steel. The same process is used in the Glock military and police handgun barrels. The systems feature a patent-pending application that uses forced hot air N2 at the mini-wave to lower the temperature of the solder and decrease the time of contact to help eliminate leaching and delaminating, improve flux activation and reduce bridging.

Wiring systems and components are laid out in an efficient, visible and easy-to-read format. This combines with easy access to all maintenance areas, for ease of service. Most options and accessories are field-retrofittable.

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