The X7056 features 3-D automatic x-ray inspection (AXI) with parallel top and bottom optical inspection. The x-ray technology is buoyed by a high-performance microfocus x-ray tube capable of ensuring a reported resolution of 15 µm per pixel. 3-D x-ray iterative modeling also yields accurate image quality. Thus, complicated overlaps on printed circuit boards populated on both sides can be resolved and easy-to-analyze features generated.

The machine can be equipped with a 6 MP sensor for high inspection depth, and AOI cameras for simultaneous, 15 µm inspection of both sides of a PCB.


Inspection speeds are a reported 20 to 40 cm²/s for AOI mode, and 6 cm²/s for 3-D AXI.

A double-track transport reduces PCB handling time. Coupled with the simultaneous inspection, the result is rapid inspection and minimal handling times. The machine is fully modular, and can be used as a combination AOI/AXI or pure AXI system.

The open all-metal x-ray tube runs on 30 to 160 kV and offers detail recognition of less than 1 µm. The tube can be automatically adjusted on the z-axis.

The system handles PCBs up to 17.7 x 13.8" on the single-track transport, and 17.7 x 7.9" on the double track. The gantry-style handler includes maintenance-free high-speed drives. PCB edge clearance is 3 mm, with upper clearance of 35 mm and lower clearance of 50 mm.

Other features include EasyPro software for rapid program generation and automatic analysis software algorithms, which include intelligent analyses for ball grid arrays and flip chips, and for standard solder or glue joints (voiding calculation), as well as bond wire sweep detection.

The X7056 is hardware- and software-compatible with all Viscom AOI systems. An optional high-performance VPC software module controls process monitoring and optimization with a multitude of filter functions.

The housing is 1.25 meters wide. System dimensions are 51.2 x 86.6 x 61.0", and it weighs 5,511 lbs. Interfaces include SMEMA and SV70.

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