News
FRANKLIN, MA – As SMT manufacturing continues to move towards smaller components, it becomes increasingly important to meet fine pitch requirements. With 0201 chips, chip scale packages and microBGAs becoming more prevalent, process engineers must understand every aspect of the fine printing process.
Speedline Technologies will address fine pitch printing in a free, live, Web seminar on Thursday,
Dec. 15, from 11 a.m. to 12 Noon, EST.
Topics will include:
* Squeegee selection
* Solder paste evaluation
* Lead free solder paste printing
* Stencil design, including pin-in-paste
* Aperture design
* 45 degree printing
* Board support
* Fast cycle time printing
* Post-print inspection (2D and 3D)
Speedline Technologies will address fine pitch printing in a free, live, Web seminar on Thursday,
Dec. 15, from 11 a.m. to 12 Noon, EST.
Topics will include:
* Squeegee selection
* Solder paste evaluation
* Lead free solder paste printing
* Stencil design, including pin-in-paste
* Aperture design
* 45 degree printing
* Board support
* Fast cycle time printing
* Post-print inspection (2D and 3D)
For more info and to register visit: speedlinetech.com/seminars or call 1-508-541-4749.
ALAMEDA, CA – Chinese companies are moving up the value chain in product design, and their engineering teams offer customers an increasing array of technical options and product features. That’s according to a new report by Technology Forecasters Inc. (techforecasters.com).
Chinese electronics manufacturing and design (EMD) services are forecast to grow 95% from an estimated $38.3 billion in 2005 to $74.7 billion in 2010, TFI found.
CRANSTON, RI – EMS provider Federal Electronics has introduced services to help OEMs convert and, if necessary, reengineer their products to comply with the European Union’s RoHS directive.
The services are designed for companies in the high-mix, high-complexity and low-to-medium volume electronics market niche that are at risk of not complying with the directive’s deadline. It aims to help companies with limited internal resources to manage the conversion.
“In addition to printed circuit board assemblies, the banned substances can be found in wire, cable, connector systems and even zinc plated sheet metal,” said Ed Evangelista, vice president. “…We recognize that the directive covers more than just PCBAs and a lead-free manufacturing process. Our services include analysis on interconnect and higher level assemblies as well.”
Available as a bundle or as-needed, the services include:
· BOM analysis and conversion to RoHS compliant material for copper and fiber optic interconnect, mixed technology PCBA and higher level assemblies.
· Assistance in selection of compliant substitutes and second sources.
· Engineering design assistance where the lack of suitable compliant components results in the need for PCBA redesign.
· Continual notifications and BOM management as component suppliers issue End Of Life statements for existing components and introduce RoHS compliant parts.
· BOM cost and lead time analysis during the conversion process
· Production conducted within lead-free compliant processes.
For more information, visit federalelec.com/rohs.
VANCOUVER -- Nam Tai Electronics' attempt to take two of its subsidiaries private has fallen short, the company said today.
Separately, the EMS firm reported a monthly sales record of $83 million in November, up $3 million from October.
Separately, the EMS firm reported a monthly sales record of $83 million in November, up $3 million from October.
Hudson, NH – CeTaQ America has enhanced capability for testing live QFPs during Machine Capability Analysis (MCA) testing.
“Rather than using dummy components, the ability to use the live QFPs brings MCA testing right up to the electronics manufacturer’s real-world manufacturing scenario,” Michael Sivigny, general manager, said in a statement. “This makes our testing methodology the most relevant and accurate that it can possibly be.”
MCA testing is a third party evaluation methodology that uses special vision algorithms, glass plates and components to measure Cp and Cpk indices on production equipment. All brands and models of SMT printers, dispensers, placement and semiconductor machines are validated. The goal is to verify that a machine is performing to the manufacturer’s original specifications, and make any necessary corrective adjustments if it is not.
In testing placement accuracy, for example, the actual fine pitch QFP components and various types of leaded devices can now be used. The pick-and-place machine places components on the test fixture marked with local reference points and fiducials. The components are analyzed against data from component data sheets. Measurements and statistical data are collected for calculating Cp and Cpk indices on side overhang, toe overhang and lead pitch, for example. These results can be used to feedback quality of incoming component material to component suppliers. The QFP components are not harmed during testing and can be returned to parts inventories for assembly after passing capability inspection.
“Rather than using dummy components, the ability to use the live QFPs brings MCA testing right up to the electronics manufacturer’s real-world manufacturing scenario,” Michael Sivigny, general manager, said in a statement. “This makes our testing methodology the most relevant and accurate that it can possibly be.”
MCA testing is a third party evaluation methodology that uses special vision algorithms, glass plates and components to measure Cp and Cpk indices on production equipment. All brands and models of SMT printers, dispensers, placement and semiconductor machines are validated. The goal is to verify that a machine is performing to the manufacturer’s original specifications, and make any necessary corrective adjustments if it is not.
In testing placement accuracy, for example, the actual fine pitch QFP components and various types of leaded devices can now be used. The pick-and-place machine places components on the test fixture marked with local reference points and fiducials. The components are analyzed against data from component data sheets. Measurements and statistical data are collected for calculating Cp and Cpk indices on side overhang, toe overhang and lead pitch, for example. These results can be used to feedback quality of incoming component material to component suppliers. The QFP components are not harmed during testing and can be returned to parts inventories for assembly after passing capability inspection.
ATLANTA -- Visiprise completed its merger with HMS Software, forming a manufacturing software environment provider with more than 270 employees and more than 200 customers.
To facilitate the transaction, Visiprise closed on over $30 million of new financing led by Investor Growth Capital and Westbury Partners. This financing also included participation from the company’s current investors.
Visiprise has re-organized into industry business units (IBUs), creating more focus around the company’s selected vertical markets – aerospace and defense, electronics, automotive and specialty vehicles, and medical devices.
Visiprise focused on high-volume, high-mix manufacturing environments with HMS Software adding low-volume asset and labor-intense manufacturing capability.
To facilitate the transaction, Visiprise closed on over $30 million of new financing led by Investor Growth Capital and Westbury Partners. This financing also included participation from the company’s current investors.
Visiprise has re-organized into industry business units (IBUs), creating more focus around the company’s selected vertical markets – aerospace and defense, electronics, automotive and specialty vehicles, and medical devices.
Visiprise focused on high-volume, high-mix manufacturing environments with HMS Software adding low-volume asset and labor-intense manufacturing capability.
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