News
A call for papers has been issued for “The Trends and Future Requirements in Automotive Electronics,” an international symposium organized by Munich Trade Fairs International. In conjunction with electronica and ProductronicaChina, this event will be held Mar. 22 and 23 at the Shanghai New International Trade Fair Center.
Symposium topics are to include power train; sensors; fuel cell and hybrid; vehicle networks; electric power steering; infotainment, and simulation and test.
Abstracts should contain title of paper, author’s contact information, and between 250 to 400 words of text describing presentation.
Deadline for submitting topic proposals is Dec. 15. Send abstracts to epc1@mmi-shanghai.com.
Symposium topics are to include power train; sensors; fuel cell and hybrid; vehicle networks; electric power steering; infotainment, and simulation and test.
Abstracts should contain title of paper, author’s contact information, and between 250 to 400 words of text describing presentation.
Deadline for submitting topic proposals is Dec. 15. Send abstracts to epc1@mmi-shanghai.com.
NEW YORK – Illinois Tool Works Inc. continued its one-company consolidation spree, acquiring electronics manufacturing equipment supplier Speedline Technologies. Financial terms of the transaction were not disclosed and the deal is expected to be completed this quarter.
Speedline has been owned by KPS Special Situations Funds, a private equity group which bought the company from Cookson for roughly $10 million in 2003. Its brands include MPM, Electrovert, Accel and Camelot.
HERNDON, VA – iNEMI’s SnPb BGA Availability Task Group has scheduled a workshop for OEMs and the BGA supply base to meet Jan. 24 in the San Jose, CA area.
The workshop will address the needs of OEMs taking the lead (Pb) exemption from the RoHS Directive. iNEMI reportedly will develop ways to work with the BGA component supply base to support SnPb-compatible BGAs, assist with questions of long-term reliability, and develop other solutions.
The group plans to create a list of critical BGA component families; estimate total available market (TAM) for these devices in SnPb assembly versions, and develop a general business case based on TAM.
Registration information is available at
http://www.inemi.org/cms/projects/ese/SnPb_BGAs.html.
The workshop will address the needs of OEMs taking the lead (Pb) exemption from the RoHS Directive. iNEMI reportedly will develop ways to work with the BGA component supply base to support SnPb-compatible BGAs, assist with questions of long-term reliability, and develop other solutions.
The group plans to create a list of critical BGA component families; estimate total available market (TAM) for these devices in SnPb assembly versions, and develop a general business case based on TAM.
Registration information is available at
http://www.inemi.org/cms/projects/ese/SnPb_BGAs.html.
MUNICH - Siemens announced that its fourth-quarter profits rose eightfold, in part because of higher earnings in its automation units.
HO CHI MINH CITY – Intel announced Friday it will more than triple its initial investment in Vietnam to $1 billion, expanding the size of a chip assembly and testing plant in HITECH Park.
OXFORDSHIRE, UK – The National Physical Laboratory will hold a meeting on copper dissolution in lead-free alloys on Dec. 7 in Oxfordshire.
According to NPL, the meeting will launch a program that intends to study various lead-free alloys under different temperatures and soldering technologies. The group plans to develop a measuring method for testing alloys.
The agenda will be set by the group’s specific production needs, designs, equipment, alloys and PCB finishes. Participants will gain access to experimental results before the end of the project.
NPL wants to develop a monitoring technique to quantify the rate of copper loss as a result of immersion in a molten metal under static and dynamic conditions; investigate copper dissolution with a range of solder alloys, PCB styles and temperatures; and produce a best practice guide to include a test method for minimizing PCB copper dissolution.
Solder manufacturers, wave soldering manufacturers and end-users are expected to make up the program team.
According to NPL, the meeting will launch a program that intends to study various lead-free alloys under different temperatures and soldering technologies. The group plans to develop a measuring method for testing alloys.
The agenda will be set by the group’s specific production needs, designs, equipment, alloys and PCB finishes. Participants will gain access to experimental results before the end of the project.
NPL wants to develop a monitoring technique to quantify the rate of copper loss as a result of immersion in a molten metal under static and dynamic conditions; investigate copper dissolution with a range of solder alloys, PCB styles and temperatures; and produce a best practice guide to include a test method for minimizing PCB copper dissolution.
Solder manufacturers, wave soldering manufacturers and end-users are expected to make up the program team.
Press Releases
- Altus Partners with Sellectronics to Enhance Manufacturing Capabilities with PVA Delta 8 System
- ITW EAE Celebrates Major Milestone in Domestic Manufacturing Expansion
- Micro Technology Services Selects PBT Works CompaCLEAN III for Advanced PCB Cleaning Performance
- Indium Corp. is Electrifying the Future with Advanced Materials Solutions at Productronica