News
San Diego residents can visit www.reconnectpartnership.com or www.sdgoodwill.org to locate a convenient Goodwill donation centers. Goodwill will sort the donated computer equipment, which will be recycled through the Dell Asset Recovery Services value recovery program. Dell's authorized product recovery partner will remarket the recycled materials, such as plastics, glass and metals, and all sales proceeds will go to Goodwill to support the non-profit's job training and employment services programs.
“This new alliance will really expand our existing electronics recycling program and further Goodwill’s mission at the same time," said Mike Rowan, CEO of Goodwill Industries of San Diego County. “Working with Dell will help us ensure we are implementing the latest environmentally sound recycling practices.”
Reconnect San Diego is the latest in a series of Dell environmental initiatives to raise awareness of the importance of responsibly recycling computers and increase recycling participation rates. Other Reconnect pilot programs are under way in Central Texas, Michigan and the San Francisco Bay area.
BRUSSELS -- An update on the status of the environmental part of TBBPA EU Risk Assessment, recently published by the European Chemicals Bureau, found that emissions of TBBPA when added to plastics can cause risks in some scenarios for surface water, sediment and soil.
No concern has been identified in practice by the risk assessment for TBBPA when used as a monomer to be reacted into the epoxy resins for the production of printed circuit board laminates. The ECB mentioned a theoretical scenario where risk reduction could operate for reactive use in cases where sewage sludge is spread to agricultural land, but there is no need for this in practice as all user sites send their industrial sludge to incineration or controlled landfills.
The update follows publication of the human health part last year in which no risks were identified.
The
environmental part of TBBPA EU Risk Assessment is expected to be finalized mid
2007.
EBFRIP believes
that most of the risks identified for additive application are manageable
through a Voluntary Emissions Control Action Programme
(VECAP)2. To date, more
than two-thirds in volumes of TBBPA additive customers in Europe have committed to control and reduce emissions.
EBFRIP will work with the UK – in charge of TBBPA Risk assessment for the EU -- which will begin draft a strategy to reduce the risks identified above.
TBBPA is used to comply with global fire safety requirements mainly as a reactive chemical in epoxy resins of printed circuit board laminates (such as FR-4, CM-1 and CM-3) and as an additive to ABS plastics
VECAP was established by
the brominated flame retardant industry, which wanted to manage, monitor and
minimise industrial emissions of commercially available brominated flame
retardants into the environment through partnership with the supply chain. Developed for deca-BDE, it
is now being applied to the main other commercial brominated flame retardants,
TBBPA and HBCD.
For a copy of the first VECAP Annual Progress Report, click here.
The new entity will be called Nokia Siemens Networks and is expected to be finalized by year-end, pending regulatory approval.
The new facility includes a state-of-the-art demo and training facility, comprehensive spare parts inventory, conference rooms, and increased office space to support BTU’s continuing growth in Southeast Asia.
At the opening ceremony, on Dec. 4, Boris Mathiszik, BTU’s director of sales for Asia Pacific, said, “We are very excited about our move and our resulting ability to better support our growing customer base in the region. With our branch office in Penang, Malaysia, and our Southeast Asia headquarters here in Singapore, we are able to provide our customers unmatched service and support capability.”
The new office address is:
BTU Overseas, Ltd
No. 9 Kaki Bukit Road 1
#02-10 Eunos Technolink
Singapore 415938
Tel : 65-67414567
General manager Mike Sivigny said, “These chips are so tiny that pad dimensions and geometries are measured in microns. If a placement machine is not operating fully within a manufacturer’s stated accuracies, there will be a higher rate of defects and reduced yields. These components are already responsible for higher defect levels than larger scale components, and are the focus of considerable process optimization efforts within the industry. Additionally, their tiny size makes manual rework difficult, compounding the negative impact of defects caused by inaccurate placement.”
The most common problems found on chip placement equipment, Sivigny adds, are systematic offsets, per head, per nozzle, per angle or simply a general offset. Offsets negatively affect chip shooter accuracy, resulting in PCB defects, lower yields, and costly manual rework. With growing demand for 01005 chip usage, placement accuracy is increasingly important.
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