WASHINGTON, DC – Recent scientific tests have revealed that Apple's iPhone contains hazardous chemicals, says Greenpeace. According to the environmental organization, tests have uncovered two types of hazardous substances,which have already been eliminated by other mobile phone makers.
In May, after thousands participated in the Green my Apple campaign, Steve Jobs claimed, "Apple is ahead of, or will soon be ahead of, most of its competitors" on environmental issues, reports Greenpeace.
The organization says it watched closely when the iPhone was launched in June for any mention of its green features, but none was mentioned. As a result, Greenpeace that month bought an iPhone and sent it to its UK research laboratories. Analysis revealed the iPhone contains toxic brominated compounds (indicating the prescence of brominated flame retardants [BFRs]) and hazardous PVC, says Greenpeace. The findings are detailed in group’s report, "Missed Call: The iPhone's Hazardous Chemicals."
An independent scientific laboratory tested 18 internal and external components of the iPhone and confirmed the presence of brominated compounds in half the samples, including in the phone's antenna, in which they made up 10% of the total weight of the flexible circuit board, says Greenpeace. A mixture of toxic phthalates was found to make up 1.5% of the plastic coating of the headphone cables, the group adds.
Dr. David Santillo, senior scientist at Greenpeace Research Laboratories, commented, "Two of the phthalate plasticisers found at high levels in the headphone cable are classified in Europe as 'toxic to reproduction, category 2' because of their long-recognized ability to interfere with sexual development in mammals. While they are not prohibited in mobile phones, these phthalates are banned from use in all toys or childcare articles sold in Europe. Apple should eliminate the use of these chemicals from its products range."
The disassembling also revealed the iPhone's battery was glued and soldered into the handset. This hinders battery replacement and makes separation for recycling, or appropriate disposal, more difficult, and therefore adds to the burden of electronic waste, Greenpeace believes.
The organization reports Nokia is PVC free, and Motorola and Sony Ericsson already have products on the market with BFR-free components. Apple's competitors have also identified extra toxic chemicals they intend to remove in the future – beyond current minimum legal requirements. Nokia and Sony Ericsson also have global takeback policies for phones and accept responsibility for reuse and recycling.
Apple does not have a global free takeback policy, so the eventual fate of the between four million and 10 million iPhones expected to be sold in its first year is uncertain, concludes Greenpeace.
EDINA, MN -- Jeff Kennedy, director of advanced manufacturing engineering at Celestica Inc., last week receivedSMTA’s Founder’s Award, the trade group’s highest individual honor.
SAN JOSE, CA – Jan Vardaman, president of TechSearch International Inc., will keynote the annual MicroElectronics Packaging and Test Engineering Council technical symposium in San Jose on Nov. 8.
In her keynote presentation, Markets and Trends in Laminate Substrates, Vardaman will present findings of the SEMI/TechSearch International Global Semiconductor Packaging Materials Outlook and provide insight into trends driving substrate developments, trends in feature size, and materials, including production capacity considerations and pricing trends.
Vardaman is the founder of TechSearch International, and the coauthor of How to Make IC Packages (published in Japanese), a columnist with Circuits Assembly, and author of numerous publications on emerging trends in semiconductor packaging and assembly.
In addition to the keynote presentation, the program has been segmented into the following focus sessions: Substrate Manufacturing and 1st Level Interconnect Technology; Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and Reliability, and Emerging Substrate Technologies.
EL SEGUNDO, CA – To say that Japanese OEMs have been shy about using contract manufacturing services could be the understatement of the year, says iSuppli Corp.
WELLESLEY, MA – The world market for mobile telematics was worth some $37.5 billion in 2006, a figure expected to reach $52 billion in 2012, a CAGR of 3.5% over the next five years, according to BCC Research.
The market includes applications of automotive, intelligent transportation systems (road installations and operations centers), aircraft, railroads, construction, agriculture and maritime technologies. Of these sectors, automotive accounts for the largest share of the market and is expected to reach more than $48 billion in 2012, at a 3.6% CAGR, says BCC. Growth in automotive telematics will be driven by government-mandated use of safety equipment.
Intelligent transport systems (road installations) currently have the second largest share of the market at $649 million, projected to reach more than $1.8 billion by 2012, a CAGR of 17.9%, according to BCC. However, intelligent transport systems (operations centers), now worth $375 million, will be worth $2 billion by 2012, a CAGR of 31.7%. The increasing sale of public roadways to private owners will speed the introduction of intelligent transport systems, with a corresponding rise in the need for mobile telematics components.
LIANYUNGANG, CHINA – Henkel Huawei Electronics Co., a joint venture of Huawei Electronics and Henkel Corp., announced plans to unveil its state-of-the-art mold compound manufacturing facility in Lianyungang, China on Oct. 26.
The operation will encompass 16,000 sq. meters of administrative and manufacturing space and reportedly will have a production capacity of 25,000 tons of material annually.
The site will be a central manufacturing hub, at which more than 10 patented epoxy mold compounds will be made, and will host product development, material prototype production, test and analysis and ongoing technology research.
The JV’s mold compound materials are currently incorporated into discrete components, SOICs, QFPs, BGAs, CSPs and POPs.