News
SANTA CLARA, CA – The Electronics Supply Chain Association announced Jim Miller of Cisco Systems has been added as a keynote presenter for the 11th Annual Electronics Supply Chain Association Conference, Oct. 29-31, in Santa Clara.
Miller, vice president, product operations, will present Value Creation throughout the Product Lifecycle.
In addition, Paul R. Brody, partner, IBM Global Business Services and Global Lead, Electronics Industry Strategy Practice, will present the opening keynote on Optimization through Collaboration: Going it Alone is No Longer an Option, and Beth McKone, vice president of worldwide program management and supply chain solutions for Solectron Corporation, will present Supply Chain Orchestration – Changing the Game by Changing the Rules.
For more information, visit www.electronicssupplychain.org.
Miller, vice president, product operations, will present Value Creation throughout the Product Lifecycle.
In addition, Paul R. Brody, partner, IBM Global Business Services and Global Lead, Electronics Industry Strategy Practice, will present the opening keynote on Optimization through Collaboration: Going it Alone is No Longer an Option, and Beth McKone, vice president of worldwide program management and supply chain solutions for Solectron Corporation, will present Supply Chain Orchestration – Changing the Game by Changing the Rules.
For more information, visit www.electronicssupplychain.org.
ATLANTA – UP Media Group Inc., parent company of Circuits Assembly and Printed Circuit Design & Manufacture, has issued a call for abstracts for PCB East 2008, which will be held May 11-16 at the Holiday Inn Select and Convention Center in Tinley Park, IL.
SHENZHEN – Endicott Interconnect Technologies has signed a lease to supply fully assembled boards via a 40,000 sq. ft. facility in Shenzhen. The lease currently covers space for one line, company sources say.
“Once volume production ramps for many boards, it can occur at EI Shenzhen, which offers both a volume production site and lower cost manufacturing,” said Stephen Howland, product manager of EI complex assembly operations.
EI Shenzhen can provide high-density hybrid PCB assemblies – double-sided complex boards with mixed technologies and an average component count of > 1500 – in sizes as large as 8" x 24" for SMT or non-SMT backplanes, the company reports.
Assembly technologies include SMT, press fit, wave solder, selective PTH solder, and hand assembly and solder. Components that can be placed on-board include high I/O area array modules (BGA/CGA down to 0.03" pitch, and PBGA), fine pitch leaded parts, and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Complete mechanicals – cage, chassis and system assemblies – can be provided, EI says.
Products for which the Shenzhen facility can provide production include motherboards for servers and communication applications, as well as controller boards for various medical and IT applications.
“Once volume production ramps for many boards, it can occur at EI Shenzhen, which offers both a volume production site and lower cost manufacturing,” said Stephen Howland, product manager of EI complex assembly operations.
EI Shenzhen can provide high-density hybrid PCB assemblies – double-sided complex boards with mixed technologies and an average component count of > 1500 – in sizes as large as 8" x 24" for SMT or non-SMT backplanes, the company reports.
Assembly technologies include SMT, press fit, wave solder, selective PTH solder, and hand assembly and solder. Components that can be placed on-board include high I/O area array modules (BGA/CGA down to 0.03" pitch, and PBGA), fine pitch leaded parts, and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Complete mechanicals – cage, chassis and system assemblies – can be provided, EI says.
Products for which the Shenzhen facility can provide production include motherboards for servers and communication applications, as well as controller boards for various medical and IT applications.
STOCKHOLM – Note will acquire 50% of a Philippines-based Ionics EMS facility in China, the company said today. The deal is expected to be accretive to sales and earnings starting in 2008. No other financial terms were disclosed.
WILSONVILLE, OR – Mentor Graphics Corp. chairman and CEO Dr. Wally Rhines will keynote the International System-on-Chip Design Conference in Seoul later this month.
Dr. Rhines’s talk will focus on changing the design rules, the company announced.
The conference runs Oct. 15-16.
For more information, visit http://www.isocc.org/.
Dr. Rhines’s talk will focus on changing the design rules, the company announced.
The conference runs Oct. 15-16.
For more information, visit http://www.isocc.org/.
BEIJING – The China Communications Standards Association has created a task force to study an e-waste recycling standard and a mandatory standard for testing detrimental chemicals in electronic products.
The latter will require all electronics communications products manufactured in the region to be tested prior to being available, according to a ChinaTechNews.com report.
The standard will emulate WEEE and RoHS to help China firms maintain components that comply with EU policies, especially companies that export products to Europe.
The latter will require all electronics communications products manufactured in the region to be tested prior to being available, according to a ChinaTechNews.com report.
The standard will emulate WEEE and RoHS to help China firms maintain components that comply with EU policies, especially companies that export products to Europe.
The study team will help the association supervise environment testing capabilities in China.
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