SARASOTA, FL — Inovaxe Corp. announced free inventory management software with each Inocart purchase effective Aug. 1.
The software provides inventory-tracking benefits, in addition to part number and quantity.
Component Add allows users to scan a bin, a component part number, inventory quantity, and to identify package status, RoHS-compliance status or vendor consignment status. It also features print label functionality.
Inventory View allows users to display all bins in the location on a single page display, while Component Remove scans a bin and presents the quantity available, allowing users to type the quantity they would like to remove.
SHENZHEN, CHINA – Endicott Interconnect Technologies has conditionally qualified its assembly operation for high-volume commercial applications in Shenzhen, and is ramping for full production.
The company leases 40,000 sq. ft. of production space in Lorom Industrial Co.’s Shenzhen facility, and has installed production equipment to support the operation.
Under the agreement, EI will provide all materials, technical know-how and training. The company will maintain control of design, new product introduction activity, specifications, quality requirements, sales and technical support worldwide.
Lorom will be responsible for facility maintenance, production staff and general support.
ELK GROVE VILLAGE, IL – EMS company SigmaTron International Inc. reported revenues increased 32.9% to $165.9 million in 2007, up from $124.8 million in 2006.
Net income decreased to $1.7 million, compared to $1.9 million last year.
For the fourth quarter, revenues increased to $39.5 million compared to $34.5 million year-over-year.
ATLANTA – A new Excel spreadsheet tool aids users in determining the best surface finish for a particular design. The tool was created by Bob Lazarra, former designer and now vice president of business development for PWB fabricator CircuitConnect.
FRANKLIN, MA – SpeedlineTechnologies will present a Webcast on reduction/elimination of two common SMT defects: tombstoning and mid-chip solder balls. The one-hour presentation takes place Aug. 16 at 11 a.m. EDT.
The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.
Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing.