News
TEDDINGTON, UK – The National Physical Laboratory seeks input for its electronics defects database.
Available soon at http://defectsdatabase.npl.co.uk, the confidential database will amass common problems and make images freely available for engineers to implement corrective actions in processes or designs.
NPL is circulating three surveys to establish the most common problems experienced or highlighted. The surveys are aimed at PCB manufacturers/distributors/brokers (http://defectsdatabase.npl.co.uk/surveys/pcb.pdf); component manufacturers & distributors (http://defectsdatabase.npl.co.uk/surveys/components.pdf); and printed circuit board assembly companies (http://defectsdatabase.npl.co.uk/surveys/assembly.pdf).
Surveys are available to download; when results are compiled, a copy of the full results will be available.
ST. PETERSBURG – EMS/ODM Foxconn Electronics plans to invest at least $50 million constructing a plant near St. Petersburg, local reports say.
According to the report, Foxconn will build several HP product lines at the plant, including PCs, LCD monitors and network gear to be sold in Russia and worldwide, the company says.
The company earlier said the suburban St. Petersburg construction site would total 60,000 sq. meters.
WASHINGTON, DC – Comments via the TBT process on Norway's Prohibition on Certain Hazardous Substances in Consumer Products regulation, known as “PoHS,” are due Aug. 10.
MANASSAS, VA – Zestron America recently completed a series of experimental tests confirming Vigon SC 200 to be fully compatible with organic solderability preservative misprinted board cleaning, the company reports.
The testing was conducted at Zestron’s technical center using a variety of lead and lead-free materials from solder paste manufacturers.
The experiments were conducted in ultrasonic and spray-in-air equipment. Variation in spray pressure ranging from 30 to 50 psi and ultrasonic frequency ranging from 10 to 20 watts per liter were considered, says Zestron.
The MPC technology-based cleaning agent was deliberately tested at 122°F to examine the worst-case scenario. Each misprinted board wash process was followed by two minutes of DI-water rinse and drying with hot circulated air for 15 minutes.
Excellent compatibility testing with OSP misprinted board cleaning was achieved at a maximum exposure time ranging from two to four minutes, depending on the solder paste formulation, the company says.
TORONTO – EMS provider SMTC Corp. reported revenue of $66.1 million for the second quarter, an increase of 8% year-over-year.
HAVERHILL, MA – Engineering firm DKN Research has developed the film base connector, the construction of which is built on a thin plastic film. It was developed for use as a high-density termination technology for flexible circuits, the company reports.
Micro bump arrays and soldering pads are built on thin heat-resistant film in this connector. The connectors are soldered on SMT boards, and flexible circuits with size hole arrays are placed on the connectors. The micro bump arrays make reliable connections to the flexible circuits, says DKN.
The connection spaces with a film base connector will be one order smaller compared to traditional connectors, the company adds. The heights of the connections can be smaller than 0.3 mm, including flexible circuits. A 6 x 10 array connector makes 60 reliable connections for finer flexible circuits than 100-µm pitches, and consumes 24 sq. millimeters for the 60 pin connections on the boards, DKN states.
Film base connectors are produced through a photolithography process. A design for the connectors will realize a high-density connection for 50-µm pitch flexible circuits in a small space, the company says.
A 1000-pin count connection in 10-mm square reportedly could be practical. Another big advantage for this connector device is repeated connections can be made where they cannot be made using other high-density termination technologies such as wire bonding and ACF connection, the company says.
DKN expect more capabilities from the termination technology because of the broad freedom of its construction. Exchangeable MCM packages, replaceable, stacked IC packages, and multi-layer rigid/flex are future goals for the company.
DKN has prepared a basic design guide explaining how to use the film base connectors with high-density flexible circuits. For more information, visit http://www.dknresearch.com/0707NewsFilmConEng.pdf.
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