TUMKUR, INDIA -- Incap Corp. has signed an agreement to acquire TVS Electronics Ltd.'s contract manufacturing operations in Tumkur in a deal worth some $10 million.
The deal includes TVS's design services in Bangalore, which will be transferred to Incap Contract Manufacturing Services Pvt. Ltd.
The publicly traded, Oulu, Finland-based Incap had sales of $121 million in 2006 and employs 550 workers. TVS's
FRANKLIN, MA – On July 19, Speedline will offer a free Webcast on stencil printing solder paste for the formation of solder bumps.
This Webinar will review all aspects of the bump printing process including stencil design, solder paste selection, fixturing and printing parameters. In addition, optimization of the related reflow soldering process will be discussed.
The one-hour presentation will start at 11:00 am EST.
WESTLAKE, OH – On April 27, Nordson Corporation filed a patent infringement action in the Tokyo District Court against Jetmaster and Jetmaster2, manufactured by Musashi Engineering Inc.
The complaint alleges that two Musashi products infringe two of Nordson’s Japanese patents, and that the operation of the Jetmaster and Jetmaster 2 infringes a third Japanese patent.
Nordson, through its subsidiary, Asymtek, owns three Japanese patents relating to DJ-2100 and DJ-9000 jet dispensers.
SCOTTSDALE, AZ – The IC industry as a whole registered a five-year CAGR of 12% between 2001 and 2006. However, the cellular phone IC market displayed the most notable CAGR of 22% during that time period, says IC Insights in its May update of the McClean Report.
For the first time ever, cellular handset unit volume shipments are forecast to total more than one billion this year, the research firm predicts.
Cellular phone handset unit shipments, revenue, and ASP are forecast to be +10%, +3%, and -6%, respectively.
Nokia is expected to ship more than 400 million handsets, and Sony Ericsson cellular phone shipments are expected to surge at least 40%, exceeding Samsung in handset revenue this year.
TAIPEI -- Asustek's chairman said the motherboard maker will its separate its contract manufacturing operations from its branded products group as soon
as possible. The company previously said it would split the divisions in 2008.
Instead, the company will split the operations by year end , and the new
company will be listed on the Hong Kong Stock Exchange, according to published reports.