News
SINGAPORE − Advanced Interconnect Technologies, a provider of semiconductor assembly and test services, announced that it has received JEDEC approval for its QFN-style Etched Leadless Package.
AIT’s patented ELP is a Quad Pb-free staggered and inline multi-row package with metallized terminals along the edges of the bottom surface. The package is offered in two- or three-row configurations. ELP reportedly offers a small footprint, low cost and design flexibility for higher I/O count.
NEENAH, WI – Plexus Corp. said that F. Gordon Bitter will retire from his role as senior vice president and chief financial officer this year.
COLORADO SPRINGS – Photo Stencil has been awarded the Best Printing Stencil Award 2006 by the Universal SMT Lab, now known as the Advanced Process Laboratory of Unovis Solutions. Photo Stencil’s AMTX E-FAB electroformed stencil placed first in the lab’s study, with the company’s NicAlloy stencil placing second.
The lab’s 2006 study isolated the stencil printing tool to determine which stencil improves the process and decreases the number of defects. The test group included five electroform stencils and seven laser stencils supplied by four leading manufacturers.
A yield analysis program determined the yield loss as a result of open defects of BGA and uBGA packages directly attributed to the stencil. The results show that, compared to the best stencil, the increase in repair costs varies from an additional $658 for the second best, to several thousand more for poor performing stencils because of higher rework. The repair cost analysis assumes a 20,000-piece board run and a cost of $75 to repair a defective board.
WASHINGTON – At the request of Tessera Inc., the U.S. International Trade Commission has opened an investigation into patent infringement.
Tessera’s complaint centers on computer chips used in mobile phones, computers and digital cameras that allegedly infringe the company’s patents, says the ITC. Possible parties to the case include Motorola Inc., Qualcomm Inc., Spansion Inc., STMicroelectonics N.V., and ATI Technologies Inc.
CHICAGO – Premier Farnell, distributor of electronic components, has launched an international design competition called Live Edge: Electronic Design for the Global Environment. Newark, a Premier Farnell business, will support the competition throughout the Americas.
Electronics engineers, students and academics are invited to submit designs that utilize electronic components and have a positive impact on the environment by increasing energy efficiency or reducing carbon emissions, for example.
The closing date for registration is Oct. 31; entries must be submitted by Nov. 30.
The winning entrant will receive a cash prize of $50,000 and a support package, estimated to be worth an additional $50,000, to help produce the design. The winner will be announced in Jan. 2008.
Full details are available at www.live-edge.com/info.
Up to five entrants will be eligible for honorable mentions, each receiving a cash prize of $5,000.
Industry judges will be announced soon. Live Edge will be largely Web-based to readily accommodate entrants on an international level.
ST. PETERSBURG, FL – Jabil Circuit Inc. has announced profits of $164.5 million based on revenue of $10.3 billion through their fiscal end of August 2006.
Despite a $28 million reduction in profits from Jabil's restatement of earnings in 2005, overall profit remained lower in 2006. Jabil earned $203.9 million, based on revenue of $7.5 billion in 2005, according to SEC restated numbers.
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