News
MYRTLE BEACH, SC – Passives components maker AVX Corp. has agreed to buy American Technical Ceramics for about $231 million in cash.
AUSTIN, TX – Samsung Electronics last week opened a 1.6 million sq. ft. 300-mm NAND flash memory wafer plant in Austin. The $3.5 billion facility will begin operations in the second half and ramp to produce 60,000 wafers monthly by 2008.
The building is one of the largest semiconductor facilities in the U.S.
The plant will begin production with the 16Gb NAND flash chips using 50-nm level process technology.
With the plant, Samsung topped its previous record for the largest foreign investment in Texas, some $1.4 billion in 1996.
The factory is adjacent to the existing 200-mm wafer fabrication plant. The existing plant was completed in 1997 and will continue to be used to manufacture DRAM.
The building is one of the largest semiconductor facilities in the U.S.
The plant will begin production with the 16Gb NAND flash chips using 50-nm level process technology.
With the plant, Samsung topped its previous record for the largest foreign investment in Texas, some $1.4 billion in 1996.
The factory is adjacent to the existing 200-mm wafer fabrication plant. The existing plant was completed in 1997 and will continue to be used to manufacture DRAM.
SAN JOSE, CA – Sanmina-SCI will build its first manufacturing technology campus in India, a 100-acre site in Oragadam inside a special economic zone.
EL SEGUNDO, CA – iSuppli Corp. predicts global PC shipments will rise to 264 million units in 2007, up 11.2% from 239 million in 2006.
iSuppli upgraded its forecast following stronger-than-anticipated first-quarter shipments of notebook computers. The previous forecast envisioned 10.7% growth for the year.
iSuppli upgraded its forecast following stronger-than-anticipated first-quarter shipments of notebook computers. The previous forecast envisioned 10.7% growth for the year.
SAN JOSE, CA – North American manufacturers of semiconductor equipment posted $1.67 billion in orders in May (three-month average) and a book-to-bill ratio of 1.0, according to SEMI.
BANNOCKBURN, IL – April shipments of rigid PCBs were down 12.8% and bookings were off 11.8% year-over-year, IPC reported today.
Shipments of rigid and flex boards decreased 12% year-over-year, and orders dropped 8.5%. Year to date, shipments are down 9.1% and bookings are down 16.5%. Compared to March, April shipments were down 16.2% and bookings were off 15.3%.
The combined industry book-to-bill ratio in April increased to 1.01, 1.28 for flex boards and 1.0 for rigid.
Year to date, rigid PCB shipments are down 9.9% and bookings are down 18.9%. Sequentially, rigid PCB shipments fell 15.5% and bookings decreased 12.6%.
Flex circuit shipments were up 3% and bookings were up 68.9% compared to April last year. For the year, flex shipments are up 3.9%, bookings 30.1%. Flex shipments fell 25.1% and bookings were down 39.2% versus March.
Shipments of rigid and flex boards decreased 12% year-over-year, and orders dropped 8.5%. Year to date, shipments are down 9.1% and bookings are down 16.5%. Compared to March, April shipments were down 16.2% and bookings were off 15.3%.
The combined industry book-to-bill ratio in April increased to 1.01, 1.28 for flex boards and 1.0 for rigid.
Year to date, rigid PCB shipments are down 9.9% and bookings are down 18.9%. Sequentially, rigid PCB shipments fell 15.5% and bookings decreased 12.6%.
Flex circuit shipments were up 3% and bookings were up 68.9% compared to April last year. For the year, flex shipments are up 3.9%, bookings 30.1%. Flex shipments fell 25.1% and bookings were down 39.2% versus March.
