New Products
BEST StencilQuik is a custom stencil designed for ball grid array (BGA) and chipscale package (CSP) placement.
AGC Multi Material Reusable Silicone Tape is for temporary fixation during SMT processes.
Cetec ERP versions 4.16, 4.17, and 4.18 include new features to streamline production, optimize inventory management, and improve communication.
Takaya APT-2400F/APT-2600FD Series flying probe, for inspection of high-density circuit boards, has a unique control mechanism and sensing technology and user-friendly interface said to reduce the load and improving operator efficiency.
Yincae UF 158UL underfill is said to fill gaps as small as 10 microns, even in 100x100mm chips.
Cybord Real-Time Interception (RTI) visual AI-powered software is said to prevent defective components from being assembled on printed circuit board assemblies (PCBAs) in real time.
Press Releases
- The Science of the Perfect Solder Joint
- Q Source Adds Electro-Tech Systems, Inc. to Supplier Lineup, Enhancing ESD and Environmental-Control Offerings
- Dynalec Selects Austin American Technology’s MicroJet EC® to Strengthen Electronics Cleaning Processes
- NOTE strengthens its leadership – Bahare Mackinovski appointed Chief Sales and Marketing Officer