News
BANNOCKBURN, IL – IPC has released IPC-7095B, Design and Assembly Process Implementation for BGAs.
This revised document focuses on applications that use both SnPb and Pb-free on the same board, including various solder ball alloys, new laminate materials for Pb-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost,” explained Ray Prasad, task group chairman.
“There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability,” he said
The standard was approved by consensus last month, said Prasad, who is also principal of Ray Prasad Consultancy Group, in a statement.
This revised document focuses on applications that use both SnPb and Pb-free on the same board, including various solder ball alloys, new laminate materials for Pb-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost,” explained Ray Prasad, task group chairman.
“There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability,” he said
The standard was approved by consensus last month, said Prasad, who is also principal of Ray Prasad Consultancy Group, in a statement.
TEDDINGTON, UK – A new approach adopted by the National Physical Laboratory has led to the design and build of the NPL – IPTM (Interconnect Properties Test Machine), says Dr. Chris Hunt and his team.
It applies defined deformation under precision control to measure materials properties. The apparatus permits materials data to be obtained from solder samples that have volumes and geometries similar to those of real solder joints, and from joints loaded in shear, mirroring the practical situation in the field.
The instrument reportedly can accommodate various solder alloys and surface coatings, and permits direct microscopic examination during the test at temperatures between -55 to 125°C.
A four-point measurement system for resistance monitoring also has been embedded and found to correlate well with structural degradation recorded during fatigue testing of solders, says NPL. The resistance measurement is directly related to the development of a crack; resistance data can be used to predict crack growth rates. The results indicate lifetime can be measured using the load decrease and/or the resistance increase. Measuring these parameters directly, for different solders and conditions, and relating them to real assembly performance, will aid modeling of lifetime prediction for Pb-free solders, says the group.
Although the mechanical behavior of Pb-free joints is known to be different from that of conventional SnPb joints, there is a lack of data suitable for modeling purposes; the need to generate such data to evaluate likely Pb-free solder performance has assumed some urgency, according to NPL.
It applies defined deformation under precision control to measure materials properties. The apparatus permits materials data to be obtained from solder samples that have volumes and geometries similar to those of real solder joints, and from joints loaded in shear, mirroring the practical situation in the field.
The instrument reportedly can accommodate various solder alloys and surface coatings, and permits direct microscopic examination during the test at temperatures between -55 to 125°C.
A four-point measurement system for resistance monitoring also has been embedded and found to correlate well with structural degradation recorded during fatigue testing of solders, says NPL. The resistance measurement is directly related to the development of a crack; resistance data can be used to predict crack growth rates. The results indicate lifetime can be measured using the load decrease and/or the resistance increase. Measuring these parameters directly, for different solders and conditions, and relating them to real assembly performance, will aid modeling of lifetime prediction for Pb-free solders, says the group.
Although the mechanical behavior of Pb-free joints is known to be different from that of conventional SnPb joints, there is a lack of data suitable for modeling purposes; the need to generate such data to evaluate likely Pb-free solder performance has assumed some urgency, according to NPL.
ARMONK,
NY -- IBM's
systems revenue rose
2% in the first quarter versus a year ago,
providing some hope for the company's EMS suppliers.
Hardware revenue was down 7% year-over-year to $4.2 billion. Excluding printers and microelectronics, revenue was up 2% versus a year ago. Storage and System z (IBM's mainframe computing) segments were each up 10%.
HELSINKI -- Nokia posted strong first-quarter results, reporting revenues of €12.66 billion, up 28% year-over-year. Operating profit rose 20% to €1.53 billion.
CARLSBAD, CA -- Palomar Microelectronics has tripled the size of its cleanroom assembly space and increased its prototyping, applications engineering, process development, assembly, and test services capabilities.
The company, a unit of Palomar Technologies, opened 2,500 sq. f. class 100K and 500 sq. ft. class 10K cleanrooms, said to enable rapid prototyping and turnaround of advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.
“The new cleanroom space allows us to provide microelectronic services for many of the emerging technologies in areas such as MEMS, high bright LEDs, and other advanced packaging applications and to speed delivery of these services to our customers,” said Donald Beck, operations manager for Palomar Microelectronics.
The company, a unit of Palomar Technologies, opened 2,500 sq. f. class 100K and 500 sq. ft. class 10K cleanrooms, said to enable rapid prototyping and turnaround of advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.
“The new cleanroom space allows us to provide microelectronic services for many of the emerging technologies in areas such as MEMS, high bright LEDs, and other advanced packaging applications and to speed delivery of these services to our customers,” said Donald Beck, operations manager for Palomar Microelectronics.
STAMFORD, CT -- Worldwide semiconductor capital equipment spending will drop 19.8% to $47.5 billion this year, says Gartner Inc.
In December, the research firm forecast a 10% drop for the year.
Global packaging and assembly equipment spending is now forecast to drop 18.1%, extending last year's 3.7% decline. Automated test equipment is expected to drop 13% this year, following last year's 14% decline. Gartner said market conditions for those segments should begin to turn up this summer.
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