News
CHANDLER, AZ -- Isola said it might raise prices up to 10% due
to cost increases in various raw materials for laminate and prepreg
products. A decision is expected in a few weeks.
Price inflation has been rampant for such materials as hydrocarbon-based products, copper and even oil. In a press release, Tim McCloskey, vice president sales, Americas, said, “Recent increases in the prices of all hydrocarbon-based products are having a significant impact on the cost structure throughout the Isola product line. In addition, rising oil prices have increased operating costs through higher natural gas prices and freight surcharges. Copper prices continue at record levels in the commodity markets, driving recent increases from the producers of electrodeposited copper foil."
"Our goal is to keep any potential increase in the 8 to 10% range. While we regret that this action may be necessary, it is quite clear that the entire supply chain in electronics manufacturing is similarly affected”, said McCloskey.
Recently, a pair of major Japan-based laminate producers raised prices about 10%.
An announcement detailing the pricing for Isola products is anticipated in the coming weeks.
Price inflation has been rampant for such materials as hydrocarbon-based products, copper and even oil. In a press release, Tim McCloskey, vice president sales, Americas, said, “Recent increases in the prices of all hydrocarbon-based products are having a significant impact on the cost structure throughout the Isola product line. In addition, rising oil prices have increased operating costs through higher natural gas prices and freight surcharges. Copper prices continue at record levels in the commodity markets, driving recent increases from the producers of electrodeposited copper foil."
"Our goal is to keep any potential increase in the 8 to 10% range. While we regret that this action may be necessary, it is quite clear that the entire supply chain in electronics manufacturing is similarly affected”, said McCloskey.
Recently, a pair of major Japan-based laminate producers raised prices about 10%.
An announcement detailing the pricing for Isola products is anticipated in the coming weeks.
SAN JOSE -- North
American-based manufacturers of
semiconductor equipment posted $1.09 billion in orders in September on
a three-month, down 1% from August and 19% from last year. The
book-to-bill ratio was 1.02, the
SEMI trade group said.
GREENVILLE, SC -- Kemet Corp. today said it is in "advanced" negotiations to acquire the tantalum capacitor business of Epcos AG. The deal is expected to close early next year, and no financial terms were disclosed.
Separately, however, Epcos said the proceeds of the sale would improve its net cash flow by at least 70 million euros.
In a press release, Kemet said the acquisition would increase its access to key markets including automotive and telecom and broaden its manufacturing base.
The deal hinges on the completion of a definitive agreement, among other customary business.
Epcos is based in Munich. The tantalum capacitor business was reportedly profitable business until 2001, but since has been hurt by overcapacity and falling prices.
Separately, however, Epcos said the proceeds of the sale would improve its net cash flow by at least 70 million euros.
In a press release, Kemet said the acquisition would increase its access to key markets including automotive and telecom and broaden its manufacturing base.
The deal hinges on the completion of a definitive agreement, among other customary business.
Epcos is based in Munich. The tantalum capacitor business was reportedly profitable business until 2001, but since has been hurt by overcapacity and falling prices.
ST. LOUIS -- LaBarge Inc. today announced net sales will
be approximately $39.6 million, down 9.2% from $43.6 million a year ago.
For its fiscal 2006 first quarter, ended Oct. 2, net earnings are expected to be $0.12 to $0.13 per diluted share, compared with $0.15 per diluted share in the comparable period a year ago.
The results would be consistent with previous guidance. In its earlier guidance, the company forecast sales of $41 million to $42 million, and diluted earnings per share of $0.12 to $0.13.
Profit margins improved during the quarter. Sales fell below projections because of several customers rescheduling shipments.
For its fiscal 2006 first quarter, ended Oct. 2, net earnings are expected to be $0.12 to $0.13 per diluted share, compared with $0.15 per diluted share in the comparable period a year ago.
The results would be consistent with previous guidance. In its earlier guidance, the company forecast sales of $41 million to $42 million, and diluted earnings per share of $0.12 to $0.13.
Profit margins improved during the quarter. Sales fell below projections because of several customers rescheduling shipments.
LAGUNA, PHILIPPINES -- Shareholders of Speedy-Tech Electronics Ltd., a
Singapore-based EMS and power electronics company, have approved the company's merger with Integrated Microelectronics Inc., a Philippines-based electronics manufacturing service provider.
The merged entity would have a combined revenue of $265 million and profit after tax and minority interests of about $30 million, based on the latest 2004 audited financials.
Singapore-based EMS and power electronics company, have approved the company's merger with Integrated Microelectronics Inc., a Philippines-based electronics manufacturing service provider.
The merged entity would have a combined revenue of $265 million and profit after tax and minority interests of about $30 million, based on the latest 2004 audited financials.
ENDICOTT, NY -- Endicott Interconnect Technologies, IBM's former manufacturing arm, has teamed with Universal Instruments Corp. to automate and
maximize production of very large, complex printed circuit cards and
assemblies.
Endicott Interconnect, which builds PCBs, assemblies and chip packages, is using Universal's Advantis Flip Chip placement system and Polaris multi-process assembly machines to fully automate production of a high-performance chip carrier for a leading military supplier.
The product has several hundred surface-mount components, several memory devices and a very large heat spreader, Endicott Interconnect said in a press statement.
"Due to the mission critical nature of the product, we require stringent accuracy along with the ability to gang pick- and-place the larger components and sophisticated parts tracking," said Raj Raj, Endicott Interconnect senior engineering manager. "In partnership with Universal, we are able to achieve an advanced and innovative solution for these unique manufacturing needs."
Endicott Interconnect, which builds PCBs, assemblies and chip packages, is using Universal's Advantis Flip Chip placement system and Polaris multi-process assembly machines to fully automate production of a high-performance chip carrier for a leading military supplier.
The product has several hundred surface-mount components, several memory devices and a very large heat spreader, Endicott Interconnect said in a press statement.
"Due to the mission critical nature of the product, we require stringent accuracy along with the ability to gang pick- and-place the larger components and sophisticated parts tracking," said Raj Raj, Endicott Interconnect senior engineering manager. "In partnership with Universal, we are able to achieve an advanced and innovative solution for these unique manufacturing needs."
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