JERUSALEM – Shellcase Ltd., a provider of wafer-level electronic product miniaturization technologies, has developed a next-generation platform for optical devices, ShellUltraThin, that provides a true die-sized package.

Based on patented packaging technology, ShellUT provides x/y dimensions identical to the original chip and a reduced thickness. A glass-silicon structure, including a cavity between the image area and the glass, enables image-sensing capabilities through the packaging structure, allowing for the use of micro-lenses. Is available for captive and non-captive license for integration into existing processing lines.

Wafer-level packaging platforms enable economies of scale for manufacturers of semiconductor device, such as CMOS and CCD area array and linear sensors, other optical devices like photodiodes, as well as various types of RF-MEMS devices, memories and mixed signals.

The company estimates that its chip size packaging solutions are used in over 30% of the installed base of camera phone handsets worldwide.

WEST CHICAGO, IL – Sales of connectors for electronics products in 2004 hit an all-time high of $143 billion in the U.S. and $286 billion worldwide, boosted by consumer electronics and consumer electrical equipment such as home appliances and HVAC units which are increasing in electronics content.

Sales were driven by strong demand for digital audio, video and home information products, consumer electrical and electronics equipment, said Bishop and Associates in a research report. 

MELVILLE, NY – Nu Horizons Electronics Corp., a distributor of active and passive electronic components, posted first-quarter net income of $475,000, down from $1.2 million in the same quarter a year ago.

Sales for the quarter ended May 31 rose to $121.4 million from $118.2 million.

SAN JOSE – May sales of semiconductors worldwide declined 0.5% sequentially to $18.05 billion, the Semiconductor Industry Association reported today. SIA cited a drop in DRAM prices as a major factor. 

May sales were up 4.1% year-over-year.