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HOLLIS, NH – A prominent electronics assembly benchmark and consulting company is launching a study on electronics box assembly cost of conversion benchmarks.

“This is an important first step in fulfilling the evolving needs of OEM and EMS organizations for box level benchmark information,” said Steve Kalenik, CEERIS International senior consultant, in a press statement.

JACKSON, MI -- Sparton Corp., a provider of electronics manufacturing services, said today that it will no longer pursue negotiations to acquire medical device manufacturer HDJ Co. and its wholly owned subsidiary, Specialized Medical Devices Inc.

The company did not disclose a reason for the decision.

ST. PETERSBURG, FL -- Jabil Circuit Inc., a top tier contract assembler, will add 500 staff to its Memphis operations by the end of the year, to support recently awarded contracts for building electronic cash registers and self-serve kiosks. Jabil will also increase the size of the facility by more than 50%.

In a press statement, operations manager Alex Privert said the company is looking for the additional employees to handle everything from electronics system configuration and integration to material handling tasks.

TAIPEI -- Taiwanese original design manufacturers will contribute about $400 million in revenues to Flextronics International in fiscal 2006, the company's chief executive said yesterday, according to published reports.

Speaking in Taipei yesterday, Flextronics chief executive Michael Marks said sales centralization of brand products coupled with declining average selling prices of ODM products is opening the door for partnerships, DigiTimes reported.

Flextronics, the world's largest EMS company, gained about $100 million in revenues from Taiwanese ODMs in 2005, Marks said.

DigiTimes also reported that a Flextronics spokeswoman denied local reports that Flextronics would partner on IT products with Asustek Computer.

According to DigiTimes, Marks said that Flextronics is concentrating on improving profitability, not revenue growth.

SINGAPORE --

Flextronics Semiconductor will use a QFN package from Advanced Interconnect Technologies for devices for next-generation consumer electronics, AIT said today.

"AIT's QFN package enables us to leverage power, footprint and performance that renders improved reliability while catering to the fast growing consumer electronics market," said Arnold Virrey, packaging manager at Flextronics.

AIT will also provide turnkey assembly, final test and tape and reel services for Flextronics.

The QFN package is said to provide superior thermal performance to leaded packages because of its exposed leadframe pad, which provides a direct path for removing heat from the package. QFN packages do not have gullwing leads which can act as antennae and create "noise" in high frequency applications.

FRANKLIN, MA – Speedline Technologies has announced a free Web seminar on fine-pitch printing, to be held July 21, at 11 a.m. (EST).

Topics will include:
   • Squeegee selection;
   • Solder paste evaluation ;
   • Lead-free solder paste printing;
   • Stencil design, including pin-in-paste;
   • Aperture design;
   • Board support;
   • Fast cycle time printing;
   • Post-print inspection (2-D and 3-D).

For more info and to register, visit speedlinetech.com/seminars.

The company will continue to offer free Webinars this fall, including a Lead-Free Overview, on Aug. 18, and Lead-Free Wave Soldering, on Sept. 15.