News
Tecnomatix Technologies Ltd. (Herzlia, Israel), a provider of manufacturing process management (MPM), announced that it has entered into a worldwide distribution agreement with SPEA (Volpiano, Italy) to market the Tecnomatix eM-Test Expert to its global customer base. SPEA manufactures and markets automatic test equipment (ATE) for microchips, electronic modules and boards.
Expanding a long relationship with Tecnomatix, SPEA will offer the solution as the preferred software package to prepare data for faster test programs generation and machine support for SPEA testers. SPEA customers include companies in a variety of industries, including industrial electronics, automotive, safety/security electronics, consumer electronics, lighting, medical electronics, telecommunications, military and aerospace.
The software helps users increase productivity and performance by optimizing test and inspection processes. It will enable SPEA customers to eliminate bottlenecks in their test processes and speed time to market of their products.
Andrea Ganio, executive manager, SPEA, said, "Through our partnership with Tecnomatix Unicam, we will be able to increase the capabilities of our automatic test equipment, while offering SPEA customers a flexible tool that integrates easily into their existing eMPower for Electronics solutions."
Copyright 2004, UP Media Group. All rights reserved.
Aguila Technologies (San Marcos, CA) announced that Henkel-Loctite Corp. (Industry, CA) has purchased a license to Aguila's patents on a pre-applied flip chip underfill technology. The Aguila license provides Henkel-Loctite the right to provide wafer-applied flip chip underfill adhesives that will enable fabrication of flip chips at lower cost and increased yield by eliminating the conventional capillary underfill technique.
Aguila's work in the field of advanced flip chip packaging over the past few years has led to over a dozen patents ranging from wafer-level and flip chip processes to no-flow underfills. Aguila's invention provides for a two-portion, or two-level, fluxing adhesive underfill approach. It overcomes the problem of applying an underfill adhesive containing filler particles to a flip chip prior to assembly.
Conventional flip chip technology generally requires that flip chip assemblies be encapsulated with an adhesive, or underfill, to protect the tiny flip chip solder joints from thermal fatigue failure. Particulate fillers in conventional underfills are the essential ingredients that reduce the adhesive's expansion rate with temperature fluctuations. The reduced expansion allows the underfill to match the expansion of the chip's solder bumps, greatly reducing fatigue failures during thermal cycling.
However, the application of underfills to finished flip chip assemblies has historically been a limiting factor to production yield and assembly cost. Conventional underfills are applied through a capillary flow liquid dispensing operation that creates a number of production obstacles.
Ideally, underfills would be applied to flip chips prior assembly. Attempts to put the essential filler particles into no-flow underfills have generally resulted in poor solder wetting and reduced product yields. The filler particles interfere with the flip chip soldering operation. These problems have led to no-flow underfills with no filler particles, limiting their usefulness.
Aguila's two-portion pre-applied underfill eliminates the problem. One portion, constituting the majority of the underfill, is filled with the essential particles that reduce thermal expansion. A second portion comprises few or no filler particles. Yet, it is the second portion that provides the fluxing action during the flip chip soldering operation. This results in a pre-applied underfill that does not interfere adversely with the soldering operation.
Aguila's innovation provides two-portion underfills that are pre-applied to flip chips, either at the wafer level, after wafer sawing, or just prior to the assembly operation. Thus, it eliminates the tedious dispense operation after flip chips are assembled. The underfill may be applied to hundreds of chips at a single time at the wafer, instead of one at a time after assembly.
Copyright 2004, UP Media Group. All rights reserved.
Panasonic Factory Automation (PFA) Co. (Elgin, IL) recently introduced its newest large screen printer, the SP60. It was designed for both the high- and low-volume manufacturer who requires ultra printing accuracy.
The screen printer's benefits include speed--6.0 sec.; accuracy--625 micron (1 mil), with repeatability of 7.5 micron (0.3 mils); and flexibility--full-floating squeegee head, selectable optimized stencil release feature, automated cleaning, universal stencil holding capability to handle 21 in. to 29 in. frames without the need for adapters.
The printer also features an intuitive programming interface. Its accurate cartridge head minimizes errors, resulting in greater productivity and efficiency.
According to IPC (Northbrook, IL), the North American IMS/PCB Industry book-to-bill ratio for January remained positive at 1.08.
The ratio is calculated by averaging the index numbers for orders booked over the past three months and dividing by the average index numbers for sales billed during the same period. A ratio of more than 1.00 suggests that current demand is ahead of supply, which indicates probable near-term growth.
Shipments increased 28.4% from January 2003 and orders booked increased 19.8% year-on-year. The shipment index was 118.1, down 6.5% from December 2003 and the IMS/PCB booking index was 125.2, down 8.7% sequentially.
The index shows how current PCB shipments and bookings relate to an index point. In this case, 1992 was chosen as the index point because it was a stable growth year for U.S. PCB manufacturers. A shipment index number of 117.0, for example, indicates that shipments are 17% higher than average shipments for the same time period in 1992.
Percentages based on the index numbers reflect changes in the size of the industry. Data reported by current participants in IPC's monthly survey, however, tell a different story. These participating companies report that their shipments increased 25.1 percent in January 2004 over January 2003, and that their orders booked increased 18.2 percent in January, year over year.
Together, these figures show a North American PCB industry that has contracted, but the companies that remain in the industry are doing better than last year.
The information in IPC's monthly industry statistics is based on data provided by PCB manufacturers that participate in IPC's monthly IMS Statistical Program. The companies reportedly represent 60% of the U.S. IMS industry.
Copyright 2004, UP Media Group. All rights reserved.
UP Media Group Inc. (Atlanta, GA) has announced the details for two technology presentations that will take place at the 13th annual PCB Design Conference West (PCB West) on March 15-19 at the San Jose Convention Center in San Jose, CA.
To kick-off this year's conference, the PCB Technology Forum and Welcome Luncheon will take place on Monday, March 15, from 12-1:30 p.m. Joseph Fjelstad, co-founder of Silicon Valley startup SiliconPipe and author of An Engineer's Guide to Flexible Circuits, will make a technical presentation on "The Benefits of Three-Dimensional Partitioning of Printed Circuit Signal Routing."
According to Fjelstad, it is often assumed that copper is just too slow for electronics applications requiring high speeds; however, the truth is that copper can transmit signals at near the speed of light if properly configured. Fjelstad's presentation will focus on an innovative process being developed at SiliconPipe. This creative destruction involves splitting an integrated circuit (IC) package I/O by launching high-speed signals through the bottom of the package, while routing lower speed power and ground signals through the bottom of the package. Signal strength and integrity should be improved, and with the high-speed I/O more accessible, the IC can be tested with full parametrics at full speed.
Conference attendees taking one of six Professional Development courses taught on Monday, March 15, may attend the PCB Technology Forum and Welcome Luncheon for free. All others who wish to attend the event may do so for a fee of $25.
A second technology presentation will be held on Thursday, March 18, from 11: 15 a.m. to 12:15 p.m., and attendance is free to all registered conference and expo-only attendees. Eric Hills, the applications engineering manager at Endicott Interconnect Technologies, will make a technical presentation on "Meeting the PCB Needs for High-Speed Data Transmission."
According to Hills, achieving data rates of up to 10 Gb/s requires close attention to transmission line geometries, dielectric properties and via utilization, as well as a physical design awareness that is not usually required. His presentation will address the methods for ensuring that the interconnections are suitable for high speeds, and how to accomplish this with traditional (i.e., cost-effective) techniques that provide maximum wiring efficiency. Special focus will be placed on the advantages that certain transmission line and via structures provide for such high-speed connections.
Before founding SiliconPipe, Fjelstad was with Tessera, where he was the company's first fellow. He is the author, co-author or editor of several books and numerous articles on electronic manufacturing. Fjelstad is also a prodigious inventor, with more than 150 U.S. patents issued or pending.
Formerly the product manager for PCBs at EIT, Hills has held positions at IBM as applications engineering manager for ceramic packaging and as new products program manager for PCBs and electronic assemblies. He has a B.S. in chemical engineering from Penn State.
UPMG is a privately held company that specializes in magazine publishing and trade show and conference production. UPMG currently publishes two high-tech magazines: Printed Circuit Design & Manufacture (www.pcdandm.com) and Circuits Assembly (www.circuitsassembly.com). In addition, UPMG produces two annual conferences and trade shows for the design and manufacture industry—PCB Design Conference West (www.pcbwest.com) in the Silicon Valley area, and PCB Design Conference East (www.pcbeast.com) in the Boston, MA, area. UPMG also hosts the PCB Design Conference Road Series (www.pcbshows.com) of courses in cities throughout the U.S.
Copyright 2004, UP Media Group. All rights reserved.
FEINFOCUS (Stamford, CT), a manufacturer of x-ray inspection systems and tubes, and GOEPEL electronic (Jena, Germany), a vendor of electronic and optical test and inspection systems, have combined their 30 years of test and inspection experience with a recent technology partnership.
The new cooperation and development project has resulted in the launch of the OptiCon X-Line inspection system, which was unveiled at Productronica 2003. The new system combines automated optical inspection (AOI) and x-ray inspection technology for the automated analysis of hidden solder joints.
The system, based on the OptiCon series from GOEPEL, provides automatic recognition of shorts and solder bridges, as well as missing solder balls on ball grid array (BGA) and microBGA devices. FEINFOCUS contributed to the development of the system with x-ray tube technology that was implemented according to GOEPEL's specifications. The companies will publish joint technical papers and application findings through the use of the combined technologies.
Copyright 2004, UP Media Group. All rights reserved.
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- Heraeus Electronics Joins EU-Funded Project FastLane to Accelerate Future of Sustainable Power Electronics
- ECD Expands Technical Service Team to Support Growing Customer Base