News
UP Media Group and Circuits Assembly, the premier magazine serving the printed circuit board (PCB) and electronics assembly marketplace, today named Mike Buetow as editor-in-chief. He replaces Lisa Hamburg Bastin, who has resigned to take a position outside the industry. The appointment is effective July 16.
Buetow is currently editor-in-chief of Printed Circuit Design & Manufacture, a UP Media Group publication, for which he has overseen all editorial and production aspects for five years. He has more than 13 years of experience in the electronics industry, including six years at electronics trade association IPC, at which he was a technical projects manager and communications director. Buetow is very familiar with the surface-mount and electronics assembly industry, previously holding editorial positions at SMT Magazine. He is a graduate of the University of Illinois.
"Having begun my career covering the SMT industry, and having worked on standards on soldering and components, I feel like I'm coming home," stated Buetow. "I look forward to assuming the lead on the world's best magazine for electronics assembly."
Hamburg Bastin led Circuits Assembly for over six years as editor-in-chief. She leaves to become editor of the National Maritime Center's publications branch. The Arlington, VA, based NMC is a Coast Guard Headquarters field unit established to promote marine safety, environmental protection and security.
"Circuits Assembly is in a very strong position to capitalize on the currently improving electronics manufacturing landscape," stated Hamburg Bastin. "Our editorial mission has always been simple: to educate assemblers about current technologies and to prepare them for future changes in packages and assembly/attachment methods. With exciting changes on the horizon such as lead free, the continuing growth in outsourcing and the narrowing barrier between back-end semiconductor manufacturing and PCB assembly, Circuits Assembly will maintain its dedication to leading-edge, award-winning editorial under the helm of Mike Buetow. I leave the magazine in the very best of hands."
Andy Shaughnessy, currently associate editor at PCD&M, has been promoted to editor of that magazine effective July 16. Shaughnessy will be working closely with publisher Pete Waddell.
"It has been my pleasure and honor to work with Lisa for over 10 years," stated Waddell. "During that time I have been impressed by her talent, her dedication and growth. I know that she will succeed in her new position, and the industry will miss her.
"On the other hand, I have every confidence in Mike and Andy," continued Waddell. "They have both proven very skillful at taking the pulse of the markets we serve, not only reporting on these markets, but providing a leadership role as well. Our culture at UP Media Group has always been to promote from within when the situation presents itself and seems logical. With Mike assuming the helm of Circuits Assembly and Andy being promoted at PCD&M, we're putting that internal policy to the best of use."
About Circuits Assembly
Circuits Assembly is the premier, award-winning magazine exclusively serving the PCB and electronics assembly marketplace. It focuses on the entire assembly process and business, including surface-mount/mixed-technology; HDI/back-end semiconductor manufacturing; component placement; screen printing; soldering; rework; test/inspection; materials; process control; data management; advanced component packaging; emerging technologies, plus much more. Circuits Assembly and its email newsletter, www.pcbupdate.com, are free to qualified professionals. Visit www.circuitsassembly.com for more information.
About UP Media Group Inc.
Headquartered in Atlanta, GA, UP Media Group (UPMG) is a privately held company that specializes in magazine publishing and trade show and conference production. UPMG currently publishes two high-tech magazines: Printed Circuit Design & Manufacture (www.pcdandm.com) and Circuits Assembly (www.circuitsassembly.com). In addition, UPMG produces two annual conferences and trade shows for the design and manufacture industry—PCB Design Conference West (www.pcbwest.com) in the Silicon Valley area, and PCB Design Conference East (www.pcbeast.com) in the New England area. UPMG also hosts the PCB Design Conference Road Series (www.pcbshows.com) of courses in cities throughout the U.S.
The CLM9000plus from ESSEMTEC (Glassboro, NJ) is based on a new software and hardware platform. The mechanical improvements include a complete new drive system which results in 20% placement speed increase, as well as improved accuracy and repeatability. Improved bearings result in longer lifetime and less wear. A newly available calibration set that includes glass plates and components allows customers to verify on-site the accuracy of the machine if needed for ISO9000 protocols.
The software is based on the Easyplacer plattform and includes new possibilities to run complete sets of boards or place single boards in multiple boards in any angle in the machine. Automatic height detection of the feeders is now integrated and the software includes an improved link to the management information system software that optimizes the production and keeps track of components and production data.
The integrated vision system from Cognex accurately locates fiducials marks, but also allows to placement beside micro ball grid arrays (BGAs), BGAs, fine pitch components and odd-shape components.
The bad mark sensing option excludes boards automatically from placement or dispensing. Free definable marks can be taught and verified. The new multi field of view option centers and inspects components up to 65 x 65 mm.
Up to 190 feeders with LED indication can be mounted and are now directly linked with ESSEMTEC's MIS system to load/reload components while the machine is placing. The machine can be equipped with a bar code-based set up control to eliminate possible set up errors.
Copyright 2004, UP Media Group. All rights reserved.
"Endicott Interconnect's printed circuit board (PCB), semiconductor packaging and complex electronic assembly business are all experiencing strong growth, and this additional expansion will position us to meet our customers' demands this year," said Jim Herard, marketing manager.
The capital package includes monies for equipment to produce PCBs greater than 28 in. long and additional lamination capacity for high performance materials. Other capacity increases for semiconductor packaging production and printed wiring board production are also included.
Also included in the package were funds for expansion and equipment for the production of complex electronic assemblies that will enter volume production later this year and additional funding for expansion in the precision machining area to be used for production of the SureScan explosive detection system announced previously by Endicott Interconnect.
Copyright 2004, UP Media Group. All rights reserved.
Ultrasonic Systems Inc. (Haverhill, MA) has developed a new solution to apply no-clean, low solids flux for lead-free wave soldering. Nozzle-free Ultra-Spray technology with reciprocating motion enables the proper amount of flux to be applied uniformly and repeatably with complete through-hole penetration.
The higher operating temperatures of lead-free alloys require flux chemistries with stable activators, excellent wetting properties and minimal post wave residue. But flux chemistry alone cannot guarantee good soldering success. Precision fluxing technology is the solution. Too little flux can cause bridging and poor wetting. Poor through-hole penetration can result in insufficient solder joints. Too much flux can cause solder balls or leave harmful residues that are not removed in modern no-clean operations.
Visit the company's Web site to learn more about the lead-free spray fluxing solution.
Copyright 2004, UP Media Group. All rights reserved.
The National Electronics Manufacturing Initiative (NEMI, Herndon, VA) has announced that Centor Software Corp. (Irvine, CA), Foxconn (Taiwan), MatrixOne (Westford, MA), Microsoft (Redmond, WA) and Speedline Technologies (Franklin, MA) are the latest companies to join the industry-led consortium.
"NEMI attracts organizations from across the supply chain, and this latest group of new member companies demonstrates our broad range of appeal," said Jim McElroy, executive director and chief executive officer of NEMI. "Our newest members include a major original equipment manufacturer (OEM) (Microsoft), a major component module move service (CMMS) provider (Foxconn), two software solution providers (Centor and MatrixOne) and a capital equipment manufacturer (Speedline). Our methodology brings together diverse interests and fosters a collaborative environment that benefits the entire industry. These new participants further strengthen our membership base and improve our effectiveness in facilitating change as we address gaps in the global electronics manufacturing infrastructure."
Dan Camarda, vice president of marketing with Centor, said, "NEMI member firms face a wide range of challenges in dealing with environmental concerns, specifically RoHS transition issues such as materials declarations. Centor is pleased to have the opportunity of working in collaboration with NEMI firms in leveraging our experience to help drive industry-standard solutions for these challenges."
Centor Software Corp. provides business analytics applications for manufacturers focused on the end-of-life and customer use stages of a product's lifecycle. Its suite of applications helps decision makers reduce regulatory compliance costs and improve product quality, ultimately increasing customer satisfaction, lowering product lifecycle costs and reducing producer liabilities. Centor's customer base includes OEMs and supply chain companies in the automotive, electronics, electrical equipment and aerospace industries.
Hon Hai Precision Industry Co. Ltd., with the registered trade name Foxconn, is an integrated global CMMS provider. The company specializes in components, modules, moves and services for computers, communications and consumer electronics. With subsidiaries and operations throughout the Americas, Europe and Asia, Foxconn is a manufacturer of PC connectors, motherboards and PC system integration..
MatrixOne Inc. delivers collaborative product lifecycle management (PLM) solutions. The flexible solutions unleash the creative power of global value chains to inspire innovations and speed them to market. The company's from the aerospace and defense, automotive, consumer products, high technology, life sciences, machinery and process industries include Agilent Technologies, General Electric, Honda, Johnson Controls, Philips, Procter & Gamble, Siemens, and Toshiba.
Founded in 1975, Microsoft is a provider of software, services and solutions that help people and businesses realize their full potential. Microsoft's Home and Entertainment Division products include Xbox game consoles and accessories and PC hardware such as keyboards, mice and other devices.
Speedline Technologies is a provider of single-source process knowledge, solutions and service to the printed circuit board assembly and semiconductor packaging industries. The company sells five brands: ACCEL microelectronics cleaning; CAMALOT dispensing systems; ELECTROVERT wave soldering, reflow soldering and cleaning equipment; MPM stencil and screen printing systems; and PROTECT global services, support and training solutions.
Copyright 2004, UP Media Group. All rights reserved.
Assembly Technology Expo (ATExpo) will mark its 25th anniversary as the trade show kicks off on Sept. 28-30, 2004, in Rosemont, IL. The ATExpo conference opens one day earlier on Sept. 27.
The event features a showcase of assembly solutions, from advanced robotic systems to hand tools. Nearly 600 suppliers will display and demonstrate new products in more than fifty categories, for use in a range of manufacturing industries, including: automotive, electronics, industrial equipment, computers, household appliances, motors and generators, medical, telecommunications and aeronautics/aerospace.
The conference will offer ten free special events as part of the Free Educational Program. The program is highlighted by three entertaining and informative keynote presentations.
The opening keynote, "Made in America," will be presented by television star John Ratzenberger, the producer and host of the Travel Channel's John Ratzenberger's Made in
America series. On the second day, "A Tale of Two Rovers—Integrating, Testing and Operating the Mars Exploration Rovers," will be delivered by Christopher Salvo, Mission Manager, Mars Exploration Rover for NASA/Jet Propulsion Laboratories. And on Sept. 30, Karl Eberle, vice president and general manager of Harley-Davidson's Kansas City assembly facility will share manufacturing successes in the revolutionary, "Relationship Driven Leadership, a Unique Manufacturing Environment."
The conference offers over 30 sessions organized into six tracks: Adhesives,
Automated Assembly, Lean Manufacturing, Manufacturing Management, Materials
Joining and Wire Processing. The organizations presenting conference sessions at the conference include: The Automated Imaging Association (AIA), APICS - the Educational Society for Resource Management, the Adhesive and Sealant Council (ASC), the Edison Welding Institute (EWI), the Robotic Industries Association (RIA), the Wiring Harness Manufacturers Association (WHMA) and ASSEMBLY magazine. Sessions will focus on a variety of topics, including lean production, flexible assembly and robotics in assembly.
Three dedicated technology pavilions make it easier for attendees to locate the specific products and suppliers they want to see. The Electronics Manufacturing Pavilion features nearly 200 suppliers offering solutions for every phase of the electronics manufacturing process, from design, packaging and fabrication to assembly and test. The pavilion also features the EASi Line, a working assembly line that incorporates sample equipment from the areas of material handling and transport, stencil printing, component pick-and-place, reflow wave solder, visual and x-ray inspection, robotic point-to-point soldering, packaging, microcontroller programming, and factory modeling and simulation. This year's line will manufacture a Light Chaser game that visitors can take home.
The Robotics Pavilion, endorsed by the RIA and AIA, is the place to find industrial robotics, flexible automation, machine vision solutions and related technologies.
The Wire Harness Pavilion showcases wire-processing solutions. Endorsed by the Wire Harness Manufacturers Association, the pavilion features new products and services for electronic cable assemblies, cord sets, wiring harnesses and other products within the wire processing industry. The Wire Processing Assembly Line (WPAL) theme this year is, "Lean Sigma Technologies To Support Wire and Cable Processing."
Copyright 2004, UP Media Group. All rights reserved.
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