caLogo
EnviroMark 907 (EM907) is a no-clean, lead-free solder paste. Designed for high-yield, lead-free manufacturing, was engineered specifically for the higher thermal demands and higher melting temperature lead-free alloys, such as the SnAgCu (SAC) alloys. Features a long stencil life, offers lead-free joints that closely resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains excellent print quality at print speeds up to 6 in/sec. (150 mm/sec). Has excellent cold and hot slump behavior, preventing bridges and solder ball formation. Said to have excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features solderability to an array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, even in air reflow. This cosmetic feature is an added benefit during inspection. The paste leaves only a light-colored residue and provides a stable tack life. 

Reflowable in air or nitrogen, prints down to 0201 pad sites, has superior printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
 
Kester, kester.com, Booth 5636

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account