Circuits Assembly Online Magazine - Kester Highlights EM907 No-Clean Pb-Free Paste

EnviroMark 907 (EM907) no-clean, lead-free solder paste is designed for the higher thermal demands of higher melting temperature lead-free alloys.

Said to feature a long stencil life and offer lead-free joints that resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains excellent print quality at print speeds up to 6 in/sec. (150 mm/sec.). Reportedly has excellent cold and hot slump behavior, thus preventing bridges and solder ball formation.

Has excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features solderability to an array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, even in air reflow, an added benefit during inspection. Leaves only a light-colored residue and provides a stable tack life. Reflowable in air or nitrogen, prints down to 0201 pad sites and meets J-STD-004 Flux Classification ROL0.

Kester, kester.com

Booth A4 363