News
STAMFORD, CT – Electronic equipment markets should begin a recovery in the fourth quarter of 2009, enabling the electronics industry to enter into a sustained recovery in the second half of 2010, with a reacceleration in sales in 2011, according to Gartner Inc.
ST. LOUIS – LaBarge Inc. has been awarded a $2.3 million contract from Northrop Grumman Corp. to continue to produce electronic equipment for the AN/AAQ-24(V) Directional Infrared Countermeasure system.
ESPOO, FINLAND – Nokia Siemens Networks has agreed to acquire certain assets from Nortel.
SAN JOSE – With 155 billion ICs produced, the value of the worldwide IC packaging market was $32.7 billion in 2008, reports Electronic Trend Publications.
BERLIN – The global semiconductor market is expected to decline 21.6% on an annualized basis to $194.8 billion in 2009, according to World Semiconductor Trade Statistics.
ST. PAUL, MN – SUSS MicroTec will distribute 3M’s wafer support system equipment for temporary wafer bonding of ultrathin wafers required for 3-D packaging.
Press Releases
- Governor Glenn Youngkin Announces First-of-its-Kind American Tin Production Facility
- Surf-Tech Manufacturing Unveils 4,000 sq-ft Expansion, Growing Operations by 50%
- Cetec ERP Expands into Europe with New Strategic Partner
- Vexos Appoints New SVP of Operational Excellence; and Expands Juarez Manufacturing Capacity