News
SAN JOSE – The MicroElectronics Packaging and Test Engineering Council has finalized the program for its first-quarter symposium, Semiconductor Packaging – Impacting the Age of Consumer Electronics.
The event will be held Feb. 19 in San Jose.
Ronald Steger, partner-in-charge of global semiconductor practice, KPMG, will keynote the symposium, discussing the consumer electronics boom – how semiconductor and consumer electronics companies can improve cost, time-to-market and product quality.
Other presentation topics include time-to-market and consumer semiconductor packaging; signal integrity: getting it right the first time; modeling package thermal behavior in advanced process technologies; time-to-market is everything; cost-of-ownership challenges for consumer products; a fabless semiconductor's point of view: IC package technology development and the total cost of ownership; an OSAT provider's point of view for consumer applications: IC package development and total cost of ownership challenges; solutions for consumer product miniaturization; STATSChipPAC – evolution of package on package; selecting the right packaging technology: finding the optimum balance between device and system level considerations in consumer applications; trends in low profile packaging; advancing technologies for consumer electronics; new tornado: adoption of MEMS processes by IC industry; microbatteries for integrated autonomous microdevices; the future of MEMS chem-bio sensors, and mobile projection displays based on biaxial scanning MEMS mirrors.
The event will be held Feb. 19 in San Jose.
Ronald Steger, partner-in-charge of global semiconductor practice, KPMG, will keynote the symposium, discussing the consumer electronics boom – how semiconductor and consumer electronics companies can improve cost, time-to-market and product quality.
Other presentation topics include time-to-market and consumer semiconductor packaging; signal integrity: getting it right the first time; modeling package thermal behavior in advanced process technologies; time-to-market is everything; cost-of-ownership challenges for consumer products; a fabless semiconductor's point of view: IC package technology development and the total cost of ownership; an OSAT provider's point of view for consumer applications: IC package development and total cost of ownership challenges; solutions for consumer product miniaturization; STATSChipPAC – evolution of package on package; selecting the right packaging technology: finding the optimum balance between device and system level considerations in consumer applications; trends in low profile packaging; advancing technologies for consumer electronics; new tornado: adoption of MEMS processes by IC industry; microbatteries for integrated autonomous microdevices; the future of MEMS chem-bio sensors, and mobile projection displays based on biaxial scanning MEMS mirrors.
NEW YORK – Dover reported fourth-quarter revenue of $1.7 billion, down 8% from last year, and net earnings from continuing operations of $170 million, down 3%.
TOKYO – The consolidation of Japan’s electronics industry is a must to stay viable, says former Sony Corp. chairman Nobuyuki Idei.
CHELMSFORD, ENGLAND – A 10-page photographic reference guide on counterfeit components is available from Bob Willis.
SANTA CLARA, CA – Intel chairman Craig Barrett will retire from active management in May at the company’s annual stockholders' meeting, the company said today.
HAVERHILL, MA – Engineering firm DKN Research and NY Industries, a circuit board manufacturer, launched a prototype and engineering service for printable electronics.
The firms established a prototype service for trials with new printable electronics products, using printing equipment and other circuit manufacturing facilities, including roll-to-roll systems with broad ranges of thick-film circuit technologies.
Ohtsu, Japan-based NY Industries is currently capable with a thick-film printing process for broad ranges of substrate materials for both rigid and flexible circuits; fine line traces down to 30 µm line and space; high conductivity thin thick-film traces down to 3 µm; single-side circuits, double-side circuits and multilayer up to eight layers; printed via holes with mechanically drilled holes and printed holes; solderable thick-film circuits; embedded resistors from 100 ohms to 10 megaohms; embedded capacitances up to 10,000 picofarads; embedded inductances with various constructions, and embedded EL devices with inorganic materials.
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