BANNOCKBURN, IL – IPC will hold a conference on November 6 at the Wyndham Hotel DFW, Irving, TX, to discuss the details of the IPC-9592 power conversion standard: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries.

The meeting will outline the process and input that went into developing this first-ever power conversion standard, which is in its final stages. The conference agenda will cover power conversion product attributes, including product specifications and document requirements; design for reliability; design and qualification testing, and manufacturing conformance testing.

The committee members for the standard will present the sessions. These volunteer members – representing Alcatel-Lucent, Cisco Systems, Dell Inc., Emerson Network Power, Hewlett-Packard Co., IBM, Lineage Power and Murata Power Solutions – will describe the logic used to craft each chapter.

For more information, visit www.ipc.org/9592conference.

YAVNE, ISRAEL – Orbotech Ltd., maker of AOI equipment, said net income for the second quarter rose to $5.3 million, compared with a loss of $3.4 million in the same quarter last year.

The company attributes its swing to a profit to improved flat panel equipment sales.

Revenue was $105.1 million, up 15.7% year-over-year, Orbotech said.

Sales of flat panel display inspection equipment nearly tripled to $29.8 million, while revenue from PCB equipment fell 22.3% to $34.5 million.

HORSHAM, PA – Aegis Software Corp., developer of MOS software, appointed Brian Worrall as director of system integration and customization services.

Worrall will ensure deployments are integrated into customers’ existing software systems and will analyze customer requirements associated with integrating process planning and launch and MOS software into existing enterprise-level capabilities.

Worrall brings nearly 20 years’ experience to the position. Prior to this appointment, he was business systems analyst and programmer for Fiber-Line Inc.

SAN JOSE – The US Patent and Trademark Office issued an office action confirming the rejections of all claims of a Tessera Technologies Inc. patent in ex parte reexamination. The patent office previously rejected these claims in an earlier action.
 
The patent relates to semiconductor packaging technologies used in a variety of applications.

The provider of miniaturization technologies is asserting the ‘326 patent in two investigations pending in the U.S. International Trade Commission against a number of companies. The first of those actions was completed July 18. The second action is scheduled for a 7-day hearing to begin on February 5.