News
ATLANTA – UP Media Group Inc., which publishes Circuits Assembly and Printed Circuit Design and Manufacture magazines, promoted editorial director Mike Buetow to vice president of editorial and production for the electronics division.
The company also named Frances Stewart vice president of sales and marketing. Stewart will be responsible for all sales and marketing in UPMG’s electronics division, including the company’s publishing and trade show operations.
Buetow, who has been editor-in-chief of Circuits Assembly since mid 2004, has more than 16 years of experience in the electronics manufacturing industry, including 10 as an editor of such titles as PC FAB and Printed Circuit Design and Manufacture. He is based in Boston.
Stewart has 25 years of experience in the electronics manufacturing industry. She is the former group publisher of Circuits Assembly, Printed Circuit Design, PC FAB and HDI magazines, and helped launch the PCB Design conferences and exhibition events. She has been an officer at the national and local levels of the SMTA trade association. She is based in Atlanta.
The company also named Frances Stewart vice president of sales and marketing. Stewart will be responsible for all sales and marketing in UPMG’s electronics division, including the company’s publishing and trade show operations.
Buetow, who has been editor-in-chief of Circuits Assembly since mid 2004, has more than 16 years of experience in the electronics manufacturing industry, including 10 as an editor of such titles as PC FAB and Printed Circuit Design and Manufacture. He is based in Boston.
Stewart has 25 years of experience in the electronics manufacturing industry. She is the former group publisher of Circuits Assembly, Printed Circuit Design, PC FAB and HDI magazines, and helped launch the PCB Design conferences and exhibition events. She has been an officer at the national and local levels of the SMTA trade association. She is based in Atlanta.
EL PASO, TX – Susan Mucha, president of EMS consulting firm Powell-Mucha Consulting, and the SMTA will present on June 6 the second part in their Webinar series on Building a Competitive EMS Brand.
The Webinar, EMS Marketing Basics, takes place from 1-2:30 p.m. EST. This online presentation will cover key considerations in differentiating a brand, developing a robust EMS marketing toolbox, and linking promotion effort to the outsourcing decision cycle.
For information and registration visit:
http://www.smta.org/education/presentations/presentations.cfm#competitive.
The cost is $75 for SMTA members and $150 for nonmembers.
To obtain a copy of the first Webinar in the series, Understanding Competitive Advantage in EMS Services, contact Mucha at smucha@powell-muchaconsulting.com.
The Webinar, EMS Marketing Basics, takes place from 1-2:30 p.m. EST. This online presentation will cover key considerations in differentiating a brand, developing a robust EMS marketing toolbox, and linking promotion effort to the outsourcing decision cycle.
For information and registration visit:
http://www.smta.org/education/presentations/presentations.cfm#competitive.
The cost is $75 for SMTA members and $150 for nonmembers.
To obtain a copy of the first Webinar in the series, Understanding Competitive Advantage in EMS Services, contact Mucha at smucha@powell-muchaconsulting.com.
EL SEGUNDO, CA – Semiconductor shipments in China will rise to $51.7 billion in 2007, up 20% from 2006, iSuppli Corp. predicted today. Shipments to China rose 15% in 2006.
ENDICOTT, NY – Endicott Interconnect Technologies has received $49 million in followup orders from the U.S. Department of Defense for electronics packaging and substrates for high-end computing.
The program includes $5 million for electronics packaging R&D, EI said.
The contract is the first of a three-phased, five-year program that uses EI as a DoD research arm for exploring high-speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design, along with fabrication of test vehicles for evaluating alternative material sets.
Phases two and three will address processing equipment for advanced technology, PCBs, substrates and assembly.
EI anticipates this will stimulate the recruitment of scientists and engineers to produce and deliver future technologies.
The program includes $5 million for electronics packaging R&D, EI said.
The contract is the first of a three-phased, five-year program that uses EI as a DoD research arm for exploring high-speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design, along with fabrication of test vehicles for evaluating alternative material sets.
Phases two and three will address processing equipment for advanced technology, PCBs, substrates and assembly.
EI anticipates this will stimulate the recruitment of scientists and engineers to produce and deliver future technologies.
ATLANTA – Manufacturers perplexed about which type of selective soldering process to use might find helpful the results of a recent survey by Stone Mountain Tool.
The survey responses revealed valuable information about different types of selective soldering machines; criteria to consider when choosing the right machine to fit a company’s goals, including advantages and disadvantages of each; cycle times, startup costs and more.
GYEONGGI-DO, KOREA – Korea's Ministry of the Environment seeks public comment on a pair of environmental rules tied to electronics equipment recycling.
Through June 7, the MoE will accept comments to the recently issued Enforcement Ordinance and the Enforcement Regulation of the Act on the Electrical and Electronic Equipment and Vehicles (Korean RoHS).
Through June 7, the MoE will accept comments to the recently issued Enforcement Ordinance and the Enforcement Regulation of the Act on the Electrical and Electronic Equipment and Vehicles (Korean RoHS).
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