News
Londonderry, NH - Cobar Solder Products, the U.S. subsidiary of Cobar Group, today celebrated its first anniversary.
In a press release, the supplier of soldering materials said its customer base is expanding.
In a statement, general manager Lance Larrabee said Cobar's "vast experience with VOC-free and lead-free products [is] a tremendous benefit to U.S. companies converting to lead-free soldering, since our products have proven their compatibility in factories around the globe."
Earlier this year, Cobar introduced a low-VOC soldering flux for lead-free soldering in wave and selective soldering systems.
WEST CHICAGO -- Samtec led all suppliers of connectors last year in customer satisfaction with lead times, according to a just released survey.
With a score of 4.829, Samtec outpolled Phoenix Contact, which scored 4.265.
Respondents to the survey, which was taken last year, described its satisfaction with each supplier on a scale of 1 to 6, with 6 being "extremely satisfied." A score of 3.50 or above indicates a degree of satisfaction. The industry average was 3.902, Bishop said.
A total of 1,604 persons responded to the poll, which was conducted by Bishop & Associates, a consulting firm. Of the respondents, 41.1% were in engineering and 40.5% were in purchasing. Just under half (49.4%) the respondents were with OEMs, while 20% were with EMS firms and 18.3% with distributors.
Finishing third was Tompeter, at 4.232, followed by W.L. Gore (4.219) and Weidmuller (4.172).
Rounding out the top 10 were Johnson Components (4.163), EDAC (4.148), Molex (4.108), Teradyne (4.07) and Kycon (4.056).
The acquisition is UGS' fourth since launching independent operations in May 2004.
The PLM software provider will market Tecnomatix as its digital manufacturing brand to include both Tecnomatix and former E-factory software. The company will offer a fully integrated solution of Tecnomatix MPM to UGS Teamcenter software users while continuing to offer the open standalone MPM solution integrated with the PLM environment of choice for its customers.
UGS plans to announce additional digital manufacturing-related technology enhancements later in 2005.
Atlanta, GA — More than 700 PCB design and engineering professionals, managers and quality engineers were introduced to a new high-reliability PCB technology for extreme environments, including life-sensitive and high-temp lead-free applications, during a live Webinar hosted by PBR Seminars on Wednesday.
Sponsored by Sierra Proto Express, a Sunnyvale, CA, PCB fabricator, the "Tomorrow's Technology, Today" Webinar featured presentations by Sierra Proto Express CEO Ken Bahl and VP of R&D Bob Tarzwell.The seminar introduced attendees to the first true lead-free compatible PCBs that are guaranteed not to fail in process or use in a lead-free assembly environment, and addressed two urgent needs in the PCB Industry:
· Complying with the European Lead-Free RoHS initiative by July 1, 2006.
· Fabrication of new high-reliability PCBs for extreme environments and life-sensitive applications that can withstand up to 2,000 cycles of -45 to +145˚ C.
The Webinar reviewed the needs associated with lead-free printed circuits and discussed materials suitable for meeting the lead-free directives. It is now available for free on-demand viewing.
Three additional technical Webinars featuring industry experts Doug Brooks and Rick Hartley will debut in April and May. For more information, visit www.pbrseminars.com.
FRANKLIN, MA - SMT manufacturing experts from Speedline Technologies will address the issues involved in "Lead-Free Reflow Soldering Power And Nitrogen Consumption" during a free, live, Web seminar on May 19 from 11 a.m. to 12 noon, ET.
Selecting a reflow oven for an SMT manufacturing process requires numerous engineering considerations, including board size capacity, heating zones, nitrogen compatibility and the ability to maintain even heat. With the introduction of lead-free materials, new and more complicated factors are compounding the decision.With the introduction of lead-free requirements, process engineers must now also consider the ability to achieve the heat required to reflow the lead-free solder paste and to cool the soldered joints at a rate that will provide the best possible product quality. In a lead-free process, two "cost of ownership" issues now gain additional significance: energy consumption and nitrogen consumption. The seminar will discuss an analysis of energy and nitrogen consumption in lead-free reflow soldering equipment.
Topics will include: a comparison of energy consumption in new reflow oven designs versus previous reflow oven designs; an actual power consumption case study of lead-free versus tin lead process; and methods for controlling nitrogen consumption.
For more information or to register, visit speedlinetech.com/seminars.
Zurich, Switzerland -- DEK has signed a supply and license agreement for its VectorGuard stencil technology with Gemido, a France-based designer and manufacturer of machines for the electronics industry. Gemido will manufacture the stencils from foil blanks supplied by DEK and will also provide customers with VectorGuard frames.
Gemido will implement this agreement in France and the French part of Switzerland.