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Minneapolis -- The Harsh Environment Electronics Workshop cosponsored by SMTA and Auburn University will be held June 28-29 in Indianapolis. The workshop will address concerns related to harsh environment electronics and challenges for auto electronics. It aims to combine the needs of end-users with the capabilities from  research and industry.
 
Will addresses the challenges of meeting expanding temperature ranges (-55°C to +150°/200°C) with increased vibration, higher packaging density and longer reliability. Next-generation requirements for automotive electronics are explored from the systems level and potential supply based solutions are presented.
 
Industrial needs for non-automotive vehicle requirements will be addressed, with session topics on:
- Thermal Interface Materials
- Component Reliability
- Module Overmolding
- Systems Design
- Lead-Free Soldering and Solder Alternatives
 
The workshop will also feature a panel discussion on lead-free for harsh applications.  
 

Bannockburn, IL - As the electronics industry races to meet the EU's RoHS Directive, IPC and Soldertec Global --a division of Tin Technology-- are sponsoring the third International Conference on Lead-Free Electronics on June 7-10 in Barcelona.                                                  

Critical lead-free issues include new alloys and materials evaluations, inspection changes, tin whiskers, lead-free on advanced packages like chip scale and flip chip, and reliability. Assembly operations will face increased assembly costs (perhaps 15% higher) and will impact areas beyond manufacturing such as field support, sales, marketing and training. 

Conference topics and educational courses will cover:

Policy development: European/Asian/other legislation or voluntary activity on hazardous materials and recycling; Legislative compliance and policy enforcement methods; 

Supply chain issues: Standards for marking and test; Materials declarations, part number, obsolescence, etc.;

Production issues: Design for lead free production; Component solder, board development, availability and lead-free compatibility; Examples of implementation; Reflow, wave, hand soldering, inspection, repair, rework and test; 

Cost issues: Tin whiskers; Reliability test data and method developments; High reliability product sectors (automotive, aerospace, etc.)

Environmental considerations: Toxicity and risk; Recycling; Substitutes for other hazardous substances. 

 

HERNDON, VA -- A new standard for simplifying materials declaration being jointly developed by several leading trade groups will be circulated for industry review in June.

In a joint statement, IPC, iNEMI and RosettaNet said the draft of IPC-1752 will be released for a 60-day industry review on June 1.

The standard will integrate existing efforts, including recommendations from a pair of iNEMI projects plus RosettaNet's e-business process standards for material composition.

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SHANGHAI -- UGS, a provider of product lifecycle management software and services, announced that Alcatel-Shanghai Bell has selected its Tecnomatix eM-Execution software for its board assembly operations and to provide traceability support and lead-free compliance.

Alcatel-Shanghai Bell will implement eM-Execution to provide full component, product and process traceability to comply with both customer and regulatory requirements. Alcatel-Shanghai Bell is also the launch customer for the new eM-Execution Lead Free solution as it prepares to meet the July 1, 2006 RoHS regulations.

"As the telecom solutions provider, we will continue to improve our product and process traceability to ensure quick response to market demands. We rely on UGS to further improve our shop floor data collection, analysis and management to meet the new Lead Free regulations," said Martin Lehnich, executive vice president of Alcatel-Shanghai Bell.

Tecnomatix is the digital manufacturing brand of UGS, which acquired Tecnomatix Technologies Ltd. on April 1.
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LIVINGSTON, SCOTLAND -- Cadence Design has closed its design services unit in Scotland's "Silicon Glen" and up to 60 staff are expected to lose their jobs.

In a published report, the company confirmed it had put its local design services staff on a 30-day consultation period from April 10, and that "a significant number" of the 90 staff were likely to lose their jobs.

Tim Barnes, vice president for marketing at Cadence, said, "We made a strategic decision two years ago to focus on our software products, which design and develop integrated circuits for semiconductor makers and others.

"As part of this strategy, we must balance our design-service capabilities as makes sense. Our core business is software."


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ST. LOUIS -- LaBarge Inc., a provider of electronics manufacturing services, has fully integrated a completely lead-free manufacturing process into its 
Pittsburgh facility, the company said today.

LaBarge handles materials, manufacture and testing of assemblies for customers
whose products must comply with new European environmental legislation.

Everything from components sourcing to soldering applications has been updated,
the company said.



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