Circuits Assembly Online Magazine - White Papers

News

Self-laminating labels (SB) from Tyco Electronics (Harrisburg, PA), a business segment of Tyco International Ltd., can mark and identify wires and cables used in most
applications. The labels use thermal transfer technology for marking, employing a translucent vinyl film substrate with a permanent acrylic adhesive. The labels are supplied with a white printable area that is over-laminated upon application with the translucent portion of the label. The labels are used in a range of electrical and electronic application, as well as in factory automation and communications equipment.

The self-lamination of the labels protects the printed area from exposure to oil, solvents, water and abrasion. The labels conform to round, irregular or flexible surface and are suitable for use in applications where the cable or wire is flexed repeatedly. For added application flexibility, labels can be flagged around a wire compared to traditional wrapping.

SB self-laminating labels have a typical shelf life of two years and a service temperature of -40 to 82°C. The minimum application temperature is 10°C. These labels can be imprinted with the T308S or T312M thermal printers. Thermal transfer ribbons from Tyco Electronics are recommended.

www.tycoelectronics.com

The RO06plus oven from ESSEMTEC (Glassboro, NJ) offers the new possibility to run test cycles with a duration of up to 18 hours. This function is mainly used in the area of
component or material testing, for special curing applications or for
burn-in in temperature ranges up to 300° C.

The oven also offers the possiblity to solder printed circuit boards (PCBs) with standard or lead-free pastes. The integrated full convection chamber ensures low delta-t values and narrow process windows. The compact design allows oven use even in narrow locations like development or testing laboratories.

The motorized drawer moves the parts or PCBs automatically into the heating chamber as soon as the programmed base temperature is reached. After finishing the temperature cylces, the automatic drawer system moves the pieces out into an integrated cooling zone.

An additional N2 connection with integrated flow meter allows oven operation with an inert atmosphere.

Software records temperature profiles of the parts/PCBs, as well as the oven temperature itself, in real time. Protocols from the software can be saved, printed and compared with original profiles.

www.essemtec.com

Viscom, Inc. (Norcross, GA) recently announced the addition of Frank Marangell as the company's new vice president of sales. In this role Frank will manage the business in the Americas.

Marangell brings 14 years of experience in the automated optical inspection (AOI) business, and he has an engineering degree and MBA.

Currently living in Boston, MA, Marangell will be relocating to the company's U.S. headquarters in Atlanta, GA.

www.viscomusa.com

Agilent Technologies Inc. (Palo Alto, CA) and Digi-Key Corp. (Thief River Falls, MN), an electronic component distributor, recently announced that they have signed a distribution agreement. The agreement allows Agilent's Semiconductor Products Group (SPG) to make an array of its products accessible to designers via Digi-Key's distribution channel and real-time online service and support site.

Digi-Key's inventory of Agilent products includes a full range of LEDs and displays, optocouplers, motion control encoders, radio frequency (RF) and microwave devices and infrared and optical transceivers. These products are used in applications that span industrial, office automation, consumer electronics, home appliances, signs and signals, wireless, networking and automotive markets.

"The addition of Digi-Key to our global distribution network will help us reach more engineers in the critical early stages of their designs," said Frank Robertazzi, vice president of worldwide distribution for Agilent's SPG. "Digi-Key's catalog distribution channel provides another avenue for our customers to purchase samples and order literature and early production quantities online at any time."

www.digikey.com

Kester (Des Plaines, IL) recently announced that chief technology officer Dennis Bernier was honored by IPC—Association Connecting Electronics (Northbrook, IL) with a Distinguished Committee Service Award. The award was presented at the IPC APEX/Expo held in late February in Anaheim, CA.

Bernier was honored as one of 12 members for their leadership and significant contributions in the development of IPC J-STD-004A, Requirement for Soldering Fluxes.

This award is given to IPC committee members who have made an exceptional contribution to a specific standard, guideline, round robin test program or other IPC program.

www.kester.com

API Electronics Group, Inc. (Hauppauge, NY) announced recently that it has purchased all of the assets of Islip Transformer & Metal Co. Inc. (Westbury, NY), a private company that supplies critical systems and components to the U.S Department of Defense (DoD). The acquisition will strengthen API's position in the defense sector, bringing additional engineering expertise and complementary product lines to the business.

Under the terms of the all cash deal, API purchased Islip's contracts, workforce, test/production equipment, product rights and trade name. Islip has current contracts totaling $882,955 and projected revenues in excess of US$1.5 million for the 2004 calendar year.

"The acquisition of the business of Islip Transformer & Metal enables API to further augment its in-demand catalogue of components and systems for both government and corporate clients," said Tom Mills, president & COO for API Electronics. "The Islip business will be integrated into our API Electronics Inc. subsidiary, and we expect to have operations moved into our technology and manufacturing center in Hauppauge, NY, by the end of April. Revenues generated from the Islip acquisition through May 31st will be reflected in API's fiscal 2004 financials, and we expect this deal to have a positive impact on our results. We further expect that Islip will bring API increased revenue on a long-term basis."

In business for over 50 years, Islip supplies the U.S. government with a wide range of electronic components and systems. Among its contracts with the DoD, Islip has supplied various types of build-to-print electronic modules, multilayer printed circuit board assemblies, flexible cables, I/O boards, radio frequency (RF) and connection cables with multiple wire strands and RF modules, and chassis assemblies. Islip components have been utilized in a variety of defense systems, including military generators, night scopes and missile systems.

Islip also manufactures and supplies the exciter component that works in conjunction with the Deck Status Light System manufactured by API's subsidiary TM Systems. This system provides helicopter pilots and flight deck crew with information about the status of landing areas.

In addition to manufacturing its own line of electronic components and systems, Islip has worked in all phases of contract manufacturing—from supplier chain control, incoming inspection and production to final assembly and testing. Contract services provided by the company include custom design, material procurement, electronic circuit board assembly, electromechanical assemblies, cable harness assemblies, and electrical and environmental testing.

www.apielectronics.com