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The National Electronics Manufacturing Initiative (NEMI, Herndon, VA) will sponsor a tin whisker workshop and a component supplier/large user meeting at the upcoming IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, NV, June 1-4.

An all-day session on June 1 will review all of the NEMI tin whisker project activities to date. Two half-day sessions are scheduled for June 2. Users and suppliers will discuss mitigation strategies and acceptance test plans for high-reliability critical systems applications in the morning session, followed by an open meeting of the Tin Whisker Accelerated Test Project in the afternoon.

With the move toward lead-free electronics, tin is considered a drop-in replacement for the tin-lead finish currently used for component terminations. However, pure tin coatings may have a tendency to grow small filaments, known as whiskers, which could bridge adjacent terminals, causing system failures. NEMI has three projects that are working on various aspects of this phenomenon: accelerated test (attempting to develop tests to predict tin whiskers), modeling (attempting to understand basic cause of whiskers) and a user group (addressing how high-reliability, long-life systems or critical applications can be protected).

The Tuesday workshop will provide an overview of more than three years' work by the three projects, including discussion of an annotated bibliography, a set of tests recommended to JEDEC, basic theories behind whisker formation and how to protect critical applications and systems given what is known today.

On Wednesday, the Tin Whisker User Group will focus on the need for mitigation practices when pure tin is used as a component terminal coating. The concern with tin whiskers in high-reliability, critical systems applications will be discussed, potential solutions outlined and tests to demonstrate compliance will be proposed.

Carol Handwerker, chief of the Metallurgy Division of the National Institute of Standards and Technology (NIST), will moderate the Tuesday workshop and Wednesday user/supplier discussions on whisker mitigation and test acceptance. Nick Vo, Motorola, will chair the Wednesday test method standardization evaluation and discussions.

All meetings will be held in the same venue as the ECTC. Anyone registered for ECTC can attend the NEMI tin whisker meetings. Individuals wishing to attend only the NEMI meetings should contact the NEMI secretariat for information (703-834-0330).

www.ectc.net

www.nemi.org

Electronics manufacturing services (EMS) provider Flextronics (Singapore) has announced results for its fourth quarter and fiscal year ended March 31, 2004. Net sales for the quarter were a record $3.8 billion, a 23% increase over the March 2003 quarter. Net sales for the fiscal year reached $14.5 billion, up $1.2 billion, or 9%, from 2003.

Proforma net income was $72.8 million, or $0.13 per diluted share for Q4, up $47.4 million from Q4 2003. Including after-tax amortization expense of $8.8 million and restructuring costs of $48.0 million, net income was $16.0 million, or $0.03 per diluted share, down from $19.5 million, or $0.04 per diluted share, year-on-year..

"Our financial results continue to improve as we realize the earnings leverage embedded in our business, said Michael E. Marks, chief executive officer of Flextronics. "Quarterly revenues grew 23% on a year-over-year basis, while proforma profits nearly tripled. Both operating margin and revenues were stronger than expected, as the quarter ended less seasonal than expected for handsets and other consumer related products."

Flextronics also announced that it intends to convert all of the outstanding 0% Convertible Junior Subordinated Notes issued in March 2003 into approximately 19 million shares of common stock. The company filed a Registration Statement on Form S-3 to register the shares, and the conversion will be completed after the Securities and Exchange Commission declares the Form S-3 effective. The conversion will not impact Flextronics' diluted EPS, as the stock equivalents have always been included in the diluted EPS calculation.

www.flextronics.com

Intellon Corp. (Ocala, FL), a provider of integrated circuits (ICs) for high-speed powerline networking, has shipped its one millionth HomePlug IC. According to the company, virtually all of the HomePlug powerline communications products in the global market today are powered by Intellon's integrated circuits.

The ICs enable high-speed communications over existing powerlines in homes and small businesses. They power over 50 products from more than 24 equipment manufacturers. These products can be purchased at retail outlets such as Best Buy, CompUSA, Circuit City, Mediamarket and Radio Shack.

Intellon customers are continuing to develop new products that take advantage of the ICs with applications as WiFi extension, online gaming, whole-house audio and security. The ICs are also being used for broadband over powerline (BPL) access applications, opening a third pipe (in addition to cable and DSL) to deliver broadband to homes and multi-dwelling units such as apartments and hotel rooms.

Intellon is extending the capability of its HomePlug product line to enable HDTV distribution over home powerlines. By the end of the year, Intellon will launch its PowerAV chipsets, which support application speeds in excess of 100 Mbps, allowing transmission of multiple audio, standard-definition video and HDTV video streams over powerlines.

Intellon Corp.is a privately-held fabless semiconductor company specializing in powerline networking and communications.

www.intellon.com

Tecnomatix Technologies Ltd. (Herzlia, Israel), a provider of manufacturing process management (MPM), has announced that Korea-based electronics manufacturing services provider Samsung Computers has implemented eMPower solutions from Tecnomatix Unicam, a wholly owned subsidiary of Tecnomatix Technologies Ltd., in its first Chinese computer manufacturing facility. The implementation helps Samsung fulfill manufacturing traceability standards required by the plant's key customer, a major computer notebook/laptop provider.

Samsung is using the traceability management and material management modules of Tecnomatix's printed circuit board (PCB) production management system for business decision-making. The traceability management module helps Samsung Computers document a product's manufacturing history. By automating this data collection process, Samsung will reduce data collection costs and achieve simple, accurate reporting of component and PCB board traceability records.

The material management module tracks material from inventory through kitting, setup and verification with real-time inventory visibility to quantity and location. The solution manages and optimizes the feeder change over process for improved throughput.

Samsung Computers has already seen return on investment with faster change over times and an improved verification processes. Shortly after the implementation at Samsung, the material management module detected a loading error related to a non-conforming part. By alerting users of the non-conformance at an early stage in the manufacturing process, Samsung avoided having to either rework the entire lot, or have a far more costly product recall later on.

"We are pleased with the early results we've experienced with the Tecnomatix solutions we've implemented," said Lee Buyng Bum, manager of Production Support Division of Samsung Electronics Suzhou Computer Co. Ltd. "Tecnomatix has delivered a very effective set of solutions and services addressing our materials handling, verification and product traceability needs. We will continue to look to Tecnomatix for new technology in these and other areas."

www.tecnomatix.com

Asymtek (Carlsbad, CA), a supplier of automated fluid dispensing systems, teamed with Cookson Electronics' Semiconductor Products Division (Alpharetta, GA) on a new project to jet underfill. Cookson Electronics Semiconductor Products visited Asymtek's application labs to test their fluid materials on Asymtek's X-1000 series, configured with the new DJ-9000 DispenseJet.

"Many of our customers use Asymtek's technology," said Mandar Painaik, technical services engineer at Cookson Materials Group. "We wanted to learn about Asymtek's equipment so we can recommend the best materials for our customers."

The collaboration enables the investigation of new and innovative jetting methods and material optimization.

The two companies work together as a part of Asymtek's Win3 program, in which key fluid formulators, technology institutes and equipment suppliers join together for the benefit of customers, each other and the industry as a whole.

One common customer uses Asymtek's platforms with the DispenseJet and DP-3000 pumps for dispensing underfills. A die placement machine, reflow oven and batch oven are in line with the dispensing equipment. According to the companies, the customer reported better dispense volume control with Asymtek's jetting technology and Cookson's Staychip 3082 underfill material.

www.asymtek.com

www.cooksonsemi.com

Data I/O Corp. (Redmond, WA) announced a net income for the first quarter of 2004 of $296,000 or $0.04 per share, compared to a net income of $317,000, or $0.04 per share, for the first quarter of 2003. Revenues for the quarter were $6.8 million, up 11% from the same period last year.

Gross margins increased by $276,000 in Q1 compared with the same period of 2003, primarily due to the higher sales level and an increase in the aftermarket sales mix. Operating expenses were higher in Q1 this year due to the company's investments in Asia and in a new venture in in-system programming (ISP) under development, as well as the unfavorable currency translation impact of European-based operating costs. The company's lean manufacturing processes continued to show results helping to reduce inventories by $555,000 during the quarter.

Fred Hume, the company's president and chief executive officer, said, "As the geographical center of the electronics manufacturing industry has shifted to Asia, we have redeployed resources to that region and are adding staff locally. This will allow us to service and support our customers there in their time zone. We have also invested in strengthening our sales organization globally in recognition of the improving climate for capital equipment."

During the quarter, the company added Joe Murdica as vice president of sales for the Americas and Asia. The company also formed a new subsidiary in Brazil specifically to support Siemens ICM handset production in Manaus.

www.data-io.com