ALLENTOWN, PA - Agere Systems has discovered a mix of ingredients said to eliminate lead from component packages. The solution calls for adding a layer of nickel to tin over copper packaging. The recipe simultaneously aims to improve chip reliability and performance, the company said today.

As of July 1, 2006, the European Union will mandate all semiconductor packages be lead-free. Most chip packages shipped today use a layer of tin and lead over copper. Lead-free substitutes will likely use tin over copper and will be processed by higher temperatures (owing to the higher reflow profiles of lead-free solder pastes).

Research at Agere has shown that tin-copper packaging meet current standard tests developed for leaded product. However, when using the products like the customer uses them, Agere has observed that commercially available tin-copper packaging form tin whiskers, which are known to cause electrical shorts and other system failures.

Three tests proposed by the Jedec Solid State Technology Association with guidance from the National Electronics Manufacturing Initiative effectively screen for susceptibility to tin whiskers. Of the three tests, two display no discernable difference between matte-tin on copper and nickel undercoated matte-tin on copper. According to Agere, a layer of nickel between the copper and tin provides "dramatic improvements" using real-world environment.

Agere evaluated semiconductor packages from multiple sources using various tin plating processes. Agere observed tin whiskers would grow on semiconductor packages after the packages had gone through a lead-free assembly process onto boards that used tin plating (instead of tin-lead).

Adding a layer of nickel between the layers of tin and copper mitigated tin whisker growth, Agere found.

"We are unveiling these findings in hopes that the electronics industry will adopt our approach to avoid the problems Agere observed in currently accepted copper and tin packages," said Dr. Melissa Grupen-Shemansky, director of packaging and interconnect technology. "We evaluated multiple options being used by other semiconductor companies in a scientifically valid study over a prolonged timeframe and found that Agere's tin-nickel-copper combination resolved the tin whisker problem seen after high-temperature, high-humidity storage."

Early results from an independent study conducted by NEMI corroborate the Agere findings on whiskers found on commercially available tin over copper packages, Agere said.

NEMI will publish its own findings next year.

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FRANKLIN, MA, Sept. 20 -- Speedline Technologies has been awarded U.S. patent no. 6,738,505 for a texture-based method of analyzing potential bridge defects on circuit boards during post-print inspection.

The patent describes the use of so-called texture-based image acquisition algorithms and a digital camera to assess of the quality of paste deposits. The patent itself describes the method of using texture in the detection of paste in a region of interest between printed deposits.

Speedline markets the process as part of the MPM BridgeVision brand.

In a statement, Dr. Gerald Pham-Van-Diep, director of advanced development, said, "Prior to our innovation, manufacturers had to either rely on contrast-based methods, where the difference between the pasted deposit and soldermask was insufficient for repeatable or rapid measurement, or were compelled to purchase expensive 100% 3D AOI systems."

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TAIPEI, Sept. 16 -- The worldwide value of global positioning systems will reach $21.5 billion in 2008, up 65% from $13 billion last year, the Industrial Economics and Knowledge Center (IEK) said today.

Based on data collected this month, GPS shipments could reach 61.3 billion units this year, up from 41.8 billion last year.

North America buys 63.3% of GPS systems sold, Europe 28% and Asia Pacific 6.3%, IEK said.

By application, handhelds make up 41% of all GPS systems, car-use 11%, mice 9%, modules 4% and wireless telecom 3%

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PITTSBURGH, Sept. 16 - John Waryold, an well-known expert in conformal coating and a 44-year veteran of electronics manufacturing, retired from HumiSeal effective Aug. 31. He will continue to advise the company in a lesser role.

Waryold, who for the past 20 years was vice president and general manager at HumiSeal, was also chairman of the task group responsible for most of the conformal coating standards in use today. 

Waryold spent 44 years at HumiSeal, beginning his career in 1960 as a lab researcher and also holding positions in technical service and sales. He invented 1B31 and several other products that have become industry standards.

He authored several papers, and a chapter on conformal coating in the Printed Circuit Handbook. Waryold received the IPC President's Award in 2000 for chairing the task group that wrote IPC-CC-830.

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