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UP Media Group Inc. (Atlanta, GA) recently announced the winners of the Circuits Assembly 2004 Service Excellence Awards (SEAs) for Electronics Manufacturing Services (EMS) Providers and Electronics Assembly Equipment, Materials and Software Suppliers.

Participating companies' customers rated each company on a scale of 1 (poor) to 5 (superior) in five service categories: dependability/timely delivery, manufacturing quality, responsiveness to requests and changes, technology and value for the price.

From a part of each participant's entry fee, a generous donation of $5,000 was made on the their behalf to the Surface Mount Technology Association (SMTA, Minneapolis, MN) Charles Hutchins Educational Grant. In turn, the $5,000 grant is awarded annually to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging or a related field.

Established in 1997 in memory of past SMTA president and industry colleague Charles Hutchins, the grant is intended for the purchase of technical books and research materials and for participation in conferences related to electronics assembly and packaging, and donations are recognized throughout the year.

For more information on past recipients, current donors and student submissions, and for making donations securely on-line, visit http://www.smta.org/hutchins/hutchins.cfm.

Cosponsored by Circuits Assembly magazine, the Hutchins Grant is awarded each year at the SMTA Annual Meeting during the SMTA International Conference.

www.smta.org

www.upmediagroup.com

NEPCON Shanghai/Electronics Manufacturing Technology China (EMT China) will be held April 26-29 at the Shanghai Everbright Convention & Exhibition Centre. The Surface Mount Technology Association (SMTA) and the Electronics & Information Industry Sub-Council (CCPIT) of China are co-organizing the high-level surface-mount technology conference.

This year's program will consist of a keynote, technical sessions on lead-free technology and 0201 assembly and two half-day training courses on lead-free systems by industry expert and past SMTA president Dr. Jennie S. Hwang, H-Technologies Group Inc.

The Keynote and technical presentations will be given by the Ministry of Information Industry, Gartner Dataquest, Flextronics International, Indium Corp., ERSA, HITACHI, Kingston Technology Co., EKRA, Daiichi Jisugyo, Fuji, OK Interenational, Siemens Dematic and Solectron.

The first training course, Interconnection Technology and Printed Circuit Board (PCB) Surface Finish and Component Coating is intended to provide broad-based information that enhances technology foundation in preparation for lead-free implementation. The presentation will be comprised of two parts: the first will cover lead-free solder interconnections and the second will address the properties and performance of lead-free PCB surface finishes and the component lead coatings.

The second course, Manufacturing Implementation, will focus on achieving yield, quality and reliability. The course will examine the key process modules, including solder paste printing and reflow, and the system compatibility between the BGA/CSP solder sphere, assembly solder paste, component coating and PCB substrate surface finish.

http://www.smta.org/education/symposia/symposia.cfm#nepcon_shanghai

The National Electronics Manufacturing Initiative (NEMI, Herndon, VA) has issued a set of interim recommendations for lead-free component finishes to be used in high-reliability electronic applications to minimize the risk of failures caused by tin whiskers. These recommendations were developed by the consortium's Tin Whisker User Group, comprised of nine large manufacturers of high-reliability electronic assemblies that annually purchase millions of dollars of components.

The group was organized to define methods and tests that would minimize the probability of tin whiskers creating functional or reliability problems in their products. Members include Alcatel, Celestica, Cisco Systems, Delphi Electronics, HP, IBM, Lucent Technologies, Sun Microsystems and Tyco Electronics. The group consensus is that pure tin electroplating presents a risk in high-reliability applications, and they have outlined cost-effective alternatives—using known mitigation practices and some level of testing—to minimize this risk.

This second interim report updates a report published by the group in June 2003 and presents recommendations for lead-free finishes for a variety of applications. These recommendations reflect the best judgment of the group members, based on their own experiences and the available data. The document outlines specific whisker mitigation guidelines supported by the group.

The document also discusses specific component types, assessing the reliability risk of tin whiskers for each and the various mitigation strategies recommended. The group is currently in the process of extending this work to create a user acceptance specification based on the test methods defined by the NEMI Tin Whisker Accelerated Test Project.

The Tin Whisker User Group's recommendations are available at: http://www.nemi.org/projects/ese/tin_whisker_usergroup.html.

Data I/O Corp. (Redmond, WA), a provider of manual and automated programming systems, announced high volume programming support for Texas Instruments' (TI, Dallas, TX) TMS320F2810 digital signal controller on its Sprint family of device programmers. With this support, TI's automotive, white goods and industrial customers have a programming solution for the flash-based F2810 controller along with the already supported TMS320F2812 controller.

Jennifer Skinner-Gray, TMS320C2000T marketing manager, Texas Instruments, said, "TI continues to work closely with Data I/O to assure that our customers using Data I/O manual and automated programming systems have volume programming support for new C2000 controllers as they become available."

The 32-bit digital signal controllers are digital signal processing (DSP)-based cores optimized for control applications that require the peripheral set and ease-of-use of a microcontroller (MCU). The result is a highly integrated system on chip (SoC)-like device that is able to handle control system processing requirements, as well as replace control system host MCUs.

"We are pleased to announce this support for the F2810," said Bruce Rodgers, Data I/O Director of Semiconductor Relations & Marketing. "The automotive market is an important customer group for our company, and we expect many users will embrace this family of TI devices for their range of applications."

www.dataio.com

www.ti.com

According to IPC (Northbrook, IL), the North American interconnect manufacturing services (IMS)/ printed circuit board (PCB) industry book-to-bill ratio for February remained firm at 1.08. The ratio is calculated by averaging the index numbers for orders booked over the past three months and dividing by the average index numbers for sales billed during the same period. A ratio of more than 1.00 suggests that current demand is ahead of supply, which indicates probable near-term growth.

Shipments in February increased 27.5% year-on-year, while orders booked increased 42%. Shipments of PCBs are up 27.9% year-to-date, with bookings up 30.9%.

The February shipment index was 131.4, up 11.3% from January, and the booking index was 144.4, up 15.3%..

The index shows how current PCB shipments and bookings relate to an index point. In this case, 1992 was chosen as the index point because it was a stable growth year for U.S. PCB manufacturers. A shipment index number of 117.0, for example, indicates that shipments are 17% higher than average shipments for the same time period in 1992.

Survey participants report shipments have increased 28.6% year-to date and bookings have increased 33.6%.

The information in IPC's monthly industry statistics is based on data provided by PCB manufacturers that participate in the IMS Statistical Program. These companies represent approximately 60% of the U.S. IMS industry.

www.ipc.org

Tecnomatix Technologies Ltd. (Herzlia, Israel), a provider of manufacturing process management (MPM), announced that Bosch Security Systems Ltd. has selected eMPower solutions from Tecnomatix Unicam for its manufacturing site in China. Tecnomatix Unicam is a wholly owned subsidiary of Tecnomatix Technologies.

The solutions—including eM-Assembly Expert and eM-Test Expert—will help the company facilitate machine setup and reduce the impact of product changeover in the company's high-mix, low-volume manufacturing environment. Eventually, Bosch plans to extend the application to the shop floors as well. This initiative will begin with the Bosch Security Systems facility in Zhuhai, South China.

Tecnomatix Technologies Ltd. also predicted that sales will rise by 15 to 20% in 2005 on top of the 15% growth projected for 2004, helped by higher demand from manufacturers and cost-cutting efforts.

Tecnomatix, a provider of robotic simulation and engineering software, has weathered a three-year slump by reducing 25% of its work force. Demand started to pick up in the December quarter, as it signed a $50 million contract with a major U.S. automotive maker.

In 2003, the company posted revenue of $86.3 million and a loss of $10.3 million.

The bulk of Tecnomatix's revenue comes from Europe and North America. It is expanding rapidly in China, where it faces the double-edged sword of surging demand and rampant piracy.

www.tecnomatix.com