News
Digi-Key Corp. (Thief River Falls, MN) and AVX (Myrtle Beach, SC) have signed a global agreement allowing Digi-Key to distribute AVX products. For AVX, Digi-Key will serve as a channel partner, managing an extensive customer base that includes technology leaders as well as small and emerging customers. AVX will enhance Digi-Key's product offering in a variety of categories allowing customers more choices in component technology.
Mark Larson, president of Digi-Key, said, "Digi-Key's ability to provide off-the-shelf delivery on a broad range of AVX components for both prototype and production needs should translate into a real advantage for Digi-Key's customers."
AVX capacitor products are widely used and Digi-Key meets the specific demands of this important area of the electronics market. Digi-Key offers a variety of standard AVX capacitors, oscillators, varistors and interconnect, as well as more innovative products like the OxiCap, which is a low voltage, non-burn capacitor, ideal for replacing surface-mount device (SMD) aluminum electrolytics.
Digi-Key is a full service provider of prototype/design as well as production volume quantities of electronic components.
Serving a broad range of markets including: telecommunications, data processing, automotive, consumer and medical sectors, AVX serves the passive electronic component and interconnect products industries.
Copyright 2004, UP Media Group. All rights reserved.
phoenix|x-ray Systems + Services Inc. (Camarillo, CA) has introduced the nanome|x, a high-powered nanofocus four-in-one failure analysis system. The x-ray inspection and failure analysis system can perform sophisticated nondestructive testing processes and resolve minute details. The system is designed to meet manufacturers' requirements of complex semiconductor devices and highly integrated electronic assemblies, yet can be used in the field of micromechanics and material testing as well.
The design is a result of a close partnership with its customers across several fields of applications. As a result, the system uses a high-powered nanofocus tube that can be operated in four modes covering the range from nanometer resolution to high-power radiation. Users can resolve an extreme level of detail (200-300 nm or 0.2-0.3 microns), displaying the slightest defect in miniaturized assemblies, such as pad wetting failures in flip chip solder joints or cracks in bond wires with verifiable results.
The same tube is infinitely variable up to 160kV and can also power up to 50W to see through highly absorbent materials like tungsten alloys used in IC packages or injector nozzles or microelectromechanical systems (MEMS).
The system deploys the company's ovhm|module technology that, without rotation of the board and thus loss of magnification in the oblique, allows for a high magnification (2000x) and 3-D-like imagery with 2-D magnification acquisition speeds. The tube and detector rotate up to 70° around the sample while providing the needed oblique view necessary to see minute defects in small solder joints found in fine-pitch ball grid arrays (FBGAs), microBGAs, column-grid arrays (CGAs), chip-scale packages (CSPs) and flip chips. This option is ideal for determining z-position solder voids, inspecting wetting quality, detecting cracks in bond wires, inspecting BGA device joint stacks and ball bond quality and measurement of via plating in both IC and printed circuit board (PCB) production.
The intensifier in the system is a digital detector technology and video system that delivers distinct images in pseudo real-time of poor absorbing materials with enhanced contrast.
Additional features include the automated inspection of BGA and quad flat pack (QFP) solder joints by an algorithm for the automated pad wetting analysis, software for the automated backend, software for the automated die-attach voiding calculation following user-defined standards and an ergonomic design for comfortable operation.
Copyright 2004, UP Media Group. All rights reserved.
The National Electronics Manufacturing Initiative (NEMI, Herndon, VA), an industry-led consortium focused on strengthening the global electronics supply chain, and the IEEE Components, Packaging and Manufacturing Technology Society (CPMT, Piscataway, NJ) have entered into a formal agreement that outlines key areas of collaboration between the two organizations.
One of the primary collaborations under this new agreement will be roadmap development, beginning with the 2004 NEMI roadmap. The roadmaps, created every two years, map the future manufacturing needs of the electronics industry to identify the key technology and infrastructure developments required to assure leadership of the global supply chain over the next decade. It helps companies anticipate shifts in product requirements and provides an early warning of changes in technology or infrastructure.
The CPMT Society's members are technical professionals whose fields of expertise complement and substantially overlap with NEMI, and many CPMT Society members have represented their respective employers in the development of previous NEMI roadmaps. With more than 40% of the Society's members outside the U.S., the CPMT Society is committing experienced professionals from Europe, Asia and North America to many of the NEMI roadmap chapter committees.
Involvement of this broad-based group will help NEMI in its efforts to globalize the scope of the 2004 roadmap. Other areas of collaboration include NEMI involvement in CPMT Society-sponsored conferences, workshops and refereed publications, and CPMT Society coordination with the NEMI Technical Committee on development of research and development priorities.
"We have worked informally with the CPMT Society for many years, but wanted to form a more structured relationship with planned activities that would allow us to work together rather than just doing things on an opportunistic basis," said Jim McElroy, executive director and chief executive officer of NEMI.
Rolf Aschenbrenner, vice president of technical activities for the CPMT Society, said, "We also look forward to NEMI members presenting their work at CPMT Society workshops and conferences as well as soliciting papers for IEEE CPMT Transactions journals. In fact, we are already coordinating a NEMI tin whisker workshop as part of our Electronic Components and Technology Conference (ECTC) in Las Vegas this June."
Copyright 2004, UP Media Group. All rights reserved.
EFD Inc. (East Providence, RI)'s new Ultra 2400 Dispensing Workstation is a precision dispensing system that applies accurate, consistent amounts of solder paste, flux, adhesives, epoxies and other fluids used in electronics assembly processes—from uniform dots as small as 0.10160 mm (0.004 in.) in diameter to neat, controlled beads.
According to the company, benefits of the system's consistent fluid application include higher yields, reduced fluid costs, better process control and shorter training time for new operators.
The workstation features a vertical design that conserves benchtop space and a footprint 60% smaller than standard electro-pneumatic dispenser configurations.
Standard features include: simultaneous digital display of dispense time, air pressure, vacuum, shot count and dispense mode, for greater process control than standard analog gauges; dispense time adjustable in 0.0001 second increments for precise control of deposit size; an internal pressure reservoir that reduces cycle time and improves deposit control; multilingual display in English, German, French, Spanish, Chinese or Japanese; automatic voltage regulation from 85 to 265 volts, with universal power plugs; automatic U.S./metric conversion of all dispensing parameters; and security lockout with tamper-proof password control
Several accessories are available to customize the workstation, including a flexible task light, a 1.7X magnifier for precision closeup work, a flexible syringe barrel holder, and an ergonomic barrel grip with a touch-sensor finger switch and LED spotlight to illuminate the dispensing area.
The system includes all components needed to begin immediate production, including dispense tips, syringe barrels and pistons matched to the user's specific application.
EFD Inc. is a wholly owned subsidiary of Nordson Corp., a producer of precision dispensing equipment.
Copyright 2004, UP Media Group. All rights reserved.
Aqueous Technologies Corp. (Rancho Cucamonga, CA) has announced the appointment of Howard Budovsky of Matthew Associates Inc. (Waban, MA) as a manufacturer's representative serving the New England Area.
With more than 15 years of experience serving all aspects of the electronics environment, Matthew Assoc. has developed long-term relationships with a large and diverse base of customers. As a manufacturer's representative, they bring to high-technology companies an array of electronics assembly products.
Aqueous has chosen Matthew Assoc. for their expertise in both the manufacturing and cleaning equipment arenas, as well as their industry knowledge, attention to detail and follow-up that Aqueous customers have come to expect.
Additionally, Matthew Assoc. offers consulting services that specialize in developing process optimization and qualification, testability, factory flow implementation, manufacturing and test equipment selection, and process qualification. These services can be offered in conjunction with equipment selection or as an independent element.
For more information on Matthew Assoc., contact Howard Budovsky, Matthew Associates, 92 Crofton Rd., Waban, MA, 02468-2115; (617) 965-6126; email: hbudovsky@matthewassociates.com.
Copyright 2004, UP Media Group. All rights reserved.
Indium Corp. (Binghamton, NY) now offers flux-coated solder preforms to support the optimization of electronic assembly processes.
According to the company, flux-coated solder preforms offer several advantages over plain solder preforms, including: improved process time—using the pre-applied, fused flux, the preforms eliminate the need to add flux as an additional process step—and improved accuracy since the process fuses precise amounts of flux onto each solder preform. The system also reduces variability by eliminating process steps and by improving the consistency and accuracy of the flux quantity.
Flux coatings are available in no-clean formulations and the solder preforms are produced in a large range of sizes and shapes, to precisely suit each requirement.
Indium Corp. is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials. The company is also a supplier of commercial grade and high-purity indium.
Copyright 2004, UP Media Group. All rights reserved.
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