BANNOCKBURN, IL – IPC and High Density Package Users Group have signed a memorandum of understanding, enabling a partnership, increased technical collaboration between groups, and a mutual path toward emerging and disruptive high-density interconnect technologies.

PISCATAWAY, NJ – The 66th annual IEEE International Electron Devices Meeting will be a virtual event Dec. 12-16.

ATLANTA – ECIA is convening experts to help modernize the component distribution channel’s design registration process. The trade group is assembling a group of subject matter experts and industry stakeholders representing the authorized component channel to include semiconductors, electromechanical/interconnect and passives, and will develop a multiphase initiative to assess the current state and what the future state might look like.

TAIPEI – Foxconn opened a research center this month to work on 5G telecommunications, artificial intelligence and cybersecurity, according to reports.