FRAMINGHAM, MA – Worldwide personal and entry-level storage (PELS) shipments totaled 68.5 million units in 2015, down 9.2% year-over-year, according to the International Data Corporation.
ARLINGTON, VA – JEDEC Solid State Technology Association published a revised standard that establishes requirements for the next generation of semiconductor device package components: JESD30G.
LITTLETON, MA – VJ Electronix and Apollo Seiko together have developed printed circuit board preheat to enhance the performance of robotic soldering.
BILLINGSTAD, NORWAY – Kitron reported fourth quarter revenue of NOK 525 million ($61.3 million), an increase of 10.3% year-over-year.
TABY, SWEDEN – Mycronic has acquired 75% of RoyoTech Digitalelektronik and has an option to acquire the remaining 25%. At the same time Mycronic has acquired 100% of Kognitec Vertrieb and Service. Both companies are based in Höhenkirchen, Germany.
INDIANAPOLIS – ACE Component Services Group and Divisys International will co-host a solderability testing and component lead tinning workshop here Mar. 8.