News
TAIPEI – Foxconn is reportedly in talks with Japanese telecom and Internet firm SoftBank to produce telecom products in India.
LYON, FRANCE – Fan-in wafer-level packaging is experiencing continuous growth and attracting new applications, a new research report says, due to "indisputable benefits" linked to cost and form factor.
SAN JOSE, CA – North America-based semiconductor equipment manufacturers saw the 90-day moving average orders rise 11% year-over-year in May.
BANNOCKBURN, IL – IPC has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
ST. PETERSBURG, FL -- Jabil Circuit reported preliminary fiscal third quarter net revenue of $4.4 billion, up 15% from a year ago.
WAYZATA, MN -- Nortech Systems today announced an agreement to acquire a privately owned Minneapolis area medical product design and engineering firm for an undisclosed price.
