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BANNOCKBURN, IL – New microvia requirements are at the heart of the latest IPC standard for bare board qualification and performance.

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OYSTER, BAY, NY – After 2020, 4G will be the leading connection technology for OEM telematics revenues, says ABI Research.

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ATLANTA – Last week’s PCB West show attendance rose 10.4% year-over-year, to more than 1,900 attendees, UP Media Group announced today.

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DUSSELDORF, GERMANY – Henkel Adhesive Technologies and molding equipment manufacturer LPMS USA have formed a partnership for building molded assemblies.

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NEVADA CITY, CA – The worldwide electronics assembly market has nearly quadrupled in size in the last 20 years, says New Venture Research, reaching some $1.4 trillion in 2015 in terms of cost of goods sold.

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CHICAGO -- A survey of 98 engineers who watched a webinar last week on on solder defect causes and cures  found that the majority feel printing is the primary source of defects and stencil design or condition the most likely culprit.

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